Silicon Deep Etcher (Plasma-Therm SLR)

Si Deep RIE (PlasmaTherm/Bosch Etch) - DECOMISSIONED

This tool does not exist in this configuration any more, so these recipes are for Reference purposes Only!!!
The machine was upgraded to be the new Plasma-Therm Fluorine ICP Etcher - the chamber configuration is now different, making these recipes invalid.
For Deep Silicon Etching, the Plasma-Therm DSE-iii is often used.  Some single-step Silicon etching is still performed on the SLR Fluorine ICP, due to the slower etch rate.

Bosch and Release Etch (Si Deep RIE)

• Bosch and Release Processes
  • Ideal for deep (>>1µm), vertical etching of Silicon. Through-wafer etches are possible (requires carrier wafer).
  • Etch rate depends on area of exposed silicon being etched.
  • Al₂O₃ mask (ALD or Sputter) has >9000:1 selectivity
  • SiO₂ (PECVD) mask has ~100:1 selectivity
  • Thermal SiO₂ has ~300:1 selectivity.

Single-step Si Etching (not Bosch Process!) (Si Deep RIE)

• Single-step Si Vertical Etch Recipe - SF₆-C₄F₈-Ar