Dry Etching Recipes: Difference between revisions

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Dry Etching Recipes
	RIE Etching				ICP Etching				Oxygen Plasma Systems				Other Dry Etchers
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	Si Deep RIE (PTI/Bosch)	ICP Etch 1 (Panasonic 1)	ICP Etch 2 (Panasonic 2)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)
Al				A		R1	R1
Ti						R1	A
Cr				A		R1	A
Ge
Ag
Pt															R1
Au															R1
Ni															R1
Cu
Ru
Mo
Ta
W-TiW						R1	A
Al₂O₃
HfO₂
ITO		R1
SiO₂						R1	R1							R1
SiN						R1	R1
SiOxNy
Ta₂O₅
TiO₂
TiN
ZnO₂
ZrO₂
GaAs				R1		R1	R1	GaAs-AlGaAs Etch (Unaxis VLR)
AlGaAs				R1		R1		GaAs-AlGaAs Etch (Unaxis VLR)
InGaAlAs		R1						InP-InGaAs-InAlAs Etch (Unaxis VLR)
InGaAsP		R1						InP-InGaAs-InAlAs Etch (Unaxis VLR)
InP		R1						InP-InGaAs-InAlAs Etch (Unaxis VLR)
GaN				R1		R1		R1
AlGaN								R1
AlN								R1
GaSb
CdZnTe		R1
ZnSe
Si					R1								R1
SiC						R1	A
Sapphire						R1	A
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	Si Deep RIE (PlasmaTherm/Bosch Etch)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)

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