E-Beam Evaporation Recipes

Back to Vacuum Deposition Recipes.

Vapor Pressure Chart and Materials Deposition Table

• Vapor Pressure of Metals (Excel)
• Lesker Deposition Table

Aluminum Deposition

• Al thickness change with deposition rate

• Morphology Variation with Deposition Rate - Ebeam 1

E-Beam 1 (Sharon)

Ar-Ion Beam Source

• Procedure and data for ion-mill in ebeam1

Materials Table (E-Beam #1)

Materials Table
Material	Position	Hearth / Crucible	Film Number	Density	Z Ratio	Tooling	Comments
Ag	4	C	5	10.5	0.529	140
Al	2	C	6	2.7	1.080	118
Al2O3	1	C	6	3.97	0.336	169
Au	4	C	4	19.3	0.381	138	Bazookas can be used at 20-30Å/sec.
AuGe	3	C	5	17.63	0.397	151	Composition unpredictable unless you practically empty the crucible.
Co	2	C	1	8.9	0.343	150	Use only with permission
Fe				7.86	0.349
Ge	3	C	6	5.35	0.516	130
Gd	3	H	3	7.89	0.670	120	Use only with permission
MgO	1		6	3.58	0.411		Use only with permission
Mo				10.2	0.257	140
Ni	1	H	1	8.91	0.331	140	Prone to spitting. Cool down for 15 minutes before venting.
NiCr	1	H	6	8.50	0.3258		Density and z-ratio for Nichrome IV
Nb	4	C	6	8.57	0.516 ( should be 0.492)		Cool down for at least 35 minutes before venting.
Pd	1	H	9	12.0	0.357	140
Pt	1	C	8	21.40	0.245	140	Prone to spitting. Evaporate at 1.5Å/sec or less.
Ru	1	C	6	12.362	0.182	142	Prone to spitting. Evaporate at 1.0Å/sec or less. Cool down for 20 minutes before venting.
Si	2	H	2	2.32	0.712	150	Cool down very slowly after evaporating lest you crack the source.
SiO		C	6	2.13	0.87	132	Use only with permission
SiO2	1	C	6	2.648	1.00	140	Please change the crystal and the upper mirror after evaporating oxide. Density 2.2-2.7 according to thin film dep. table. Use only with permission
SrF2	1	C	6	4.28	0.727	140	Use only with permission
Ta	1	H	6	16.6	0.262		Requires extremely high current. Minimum 35 minute cool down. Hearth #3 may be used. Call me before you try Ta.
W	1	C	6	19.3	0.163	138
Ti	3	H	3	4.50	0.628	139

E-Beam 2 (Custom)

Materials Table (E-Beam #2)

Materials Table
Material	Density, g/cm3	Z Ratio	Tooling factor, %	Comments
Al2O3	3.97	0.336	140.0	Tony could you please check this?
CeO2	7.13	1.000	252.0	Deposition at room temperature (see the details in the following file)
CeO2	7.13	1.000	117.0	Deposition at 200 C (see the details in the following file)
CeO2	7.13	1.000	99.7	Deposition at 250 C (see the details in the following file)
GeO2	6.24	1.000	139.0
ITO	6.43-7.14	1.000	139.0	z ratio unknown
MgO	3.58	0.411	157.6	OK
Si	2.32	0.712	150.0
SiO2	2.648	1.000	157.6	Density 2.2-2.7 according to thin film deposition tables
SiOx	2.13	0.87	130.0
SrF2	4.28	0.727	140.0
Ta2O5	8.2	0.30	157.6
TiO2	4.26	0.400	139.0

ITO deposition (E-Beam 2)

• Room-temperature ITO Deposition, Annealing, and Electrical and Optical Properties
• ITO Deposition at 200 C

CeO₂ deposition (E-Beam 2)

• Room- and High-temperature CeO₂ Depositions with and without an Additional Oxygen Gas Flow

E-Beam 3 (Temescal)

Materials Table (E-Beam #3)

Materials Table
Material	Gun	Hearth /Crucible	Process Gain, A/sec/%pwr	Film Number	Density, g/cm3	Z Ratio	Tooling, %	Comments
Ag	Rear	C	10.0	2	10.50	0.529	67
Al	Rear	C	10.0	1	2.70	1.080	53
Au	Front	C	2.0	3	19.30	0.381	56
Ge	Rear	C	10.0	3	5.35	0.516	80
Ni	Front	C	0.5	2	8.91	0.331	67
Pd	Rear	C	0.9	4	12.038	0.357	48
Pt	Front	C	0.4	1	21.40	0.245	67
Ti	Front	C	5.0	4	4.50	0.628	67

E-Beam 4 (CHA)

Materials Table (E-Beam #4)

Materials Table
Material	Density, g/cm3	Z Ratio	Master tooling, %	Process Gain, A/sec/%pwr	Comments
Ag	10.50	0.529	110	10.0
Al	2.70	1.080	165	6.0
Au	19.30	0.381	120	10.0
Co	8.90	0.343	150	5.0
Cr	7.20	0.305	140	10.0
Fe	7.86	0.349	165	10.0
Ge	5.35	0.516	126	10.0
Hf	13.09	0.360	150	10.0
Ir	22.40	0.129	130	10.0
Ni	8.91	0.331	150	5.0
NiCr	8.50	0.3258	140	10.0	density and z ratio for Nichrome IV
NiFe	8.70	1.000	100	10.0
Pd	12.038	0.357	112	10.0
Pt	21.40	0.245	130	10.0
Ru	12.362	0.182	100	10.0
Ti	4.50	0.628	183	10.0
Zr	6.49	0.600	150	10.0