E-Beam Evaporation Recipes

Back to Vacuum Deposition Recipes.

Vapor Pressure Chart and Materials Deposition Table

• Vapor Pressure of Metals (Excel)
• Lesker Deposition Table

Aluminum Deposition

• Al thickness change with deposition rate

• Morphology Variation with Deposition Rate - Ebeam 1

E-Beam 1 (Sharon)

Ar-Ion Beam Source

• Procedure and data for ion-mill in ebeam1

Materials Table (E-Beam #1)

There are four hearth "positions" able to be loaded at any one time, meaning only up to 4 materials can be evaporated without breaking vacuum. Now able to handle Four-4" wafers in one run.

Material	Position	Hearth / Crucible	Density	Z Ratio	Tooling	Comments
Ag	7 (6, 7, 8)	C	10.5	0.529	110
Al	1	C	2.7	1.080	102
Al2O3	(6, 7, 8)	C	3.97	0.336
Au	3	C	19.3	0.381	92	Bazookas can be used at 20-30Å/sec.
AuGe	(6, 7, 8)	C	17.63	0.397		Composition unpredictable unless you practically empty the crucible.
C	(6, 7, 8)	H	2.250	3.260		Carbon. Must sweep beam. 1Å/sec (fluctuating 0.4–0.9Å/sec) at ~1.4–1.6 emission.
Co	(6, 7, 8)	C	8.9	0.343		Use only with permission
Fe	(6, 7, 8)		7.86	0.349
Ge	8 (6, 7, 8)	C	5.35	0.516
Gd	(6, 7, 8)	H	7.89	0.670		Use only with permission
MgO	(6, 7, 8)		3.58	0.411		Use only with permission
Mo	(6, 7, 8)		10.2	0.257
Ni	5	H	8.91	0.331	104	Prone to spitting. Cool down for 15 minutes before venting.
NiCr	(6, 7, 8)	H	8.50	0.3258		Density and z-ratio for Nichrome IV
Nb	(6, 7, 8)	C	8.57	0.516 ( should be 0.492)		Cool down for at least 35 minutes before venting.
Pd	6 (6, 7, 8)	H	12.0	0.357	112
Pt	4	C	21.40	0.245	100	Prone to spitting. Evaporate at 1.5Å/sec or less.
Ru	(6, 7, 8)	C	12.362	0.182		Prone to spitting. Evaporate at 1.0Å/sec or less. Cool down for 20 minutes before venting.
Si	(6, 7, 8)	H	2.32	0.712		Cool down very slowly after evaporating lest you crack the source.
SiO	(6, 7, 8)	C	2.13	0.87		Use only with permission
SiO2	(6, 7, 8)	C	2.648	1.00		Use only with permission. Please change the crystal and the upper mirror after evaporating oxide. Density 2.2-2.7 according to thin film dep. table.
SrF2	(6, 7, 8)	C	4.28	0.727		Use only with permission
Ta	(6, 7, 8)	H	16.6	0.262		Requires extremely high current. Minimum 35 minute cool down. Hearth #3 may be used. Call maintainer before you try Ta.
W	(6, 7, 8)	C	19.3	0.163
Ti	2	H	4.50	0.628	109
Zr	(6, 7, 8)	C	6.49	0.600	150

E-Beam 2 (Custom)

Materials Table (E-Beam #2)

ITO deposition (E-Beam 2)

• Room-temperature ITO Deposition, Annealing, and Electrical and Optical Properties
• ITO Deposition at 200 C

CeO₂ deposition (E-Beam 2)

• Room- and High-temperature CeO₂ Depositions with and without an Additional Oxygen Gas Flow

E-Beam 3 (Temescal)

Materials Table (E-Beam #3)

The following materials are always installed in the evaporator. There are 4 materials available on each gun (front/rear guns), allowing for co-deposition by running both guns simultaneously.

Material	Gun	Hearth /Crucible	Process Gain, A/sec/%pwr	Film Number	Density, g/cm3	Z Ratio	Tooling, %	Comments
Au	Front	C	2.0	3	19.30	0.381	56
Ni	Front	C	0.5	2	8.91	0.331	67
Pt	Front	C	0.4	1	21.40	0.245	67
Ti	Front	C	5.0	4	4.50	0.628	67
Ag	Rear	C	10.0	2	10.50	0.529	67
Al	Rear	C	10.0	1	2.70	1.080	53
Ge	Rear	C	10.0	3	5.35	0.516	80
Pd	Rear	C	0.9	4	12.038	0.357	48

E-Beam 4 (CHA)

Materials Table (E-Beam #4)

Material	Density, g/cm3	Z Ratio	Master tooling, %	Process Gain, A/sec/%pwr	Comments
Au	Front	C	2.0	3	19.30	0.381	56
Ni	Front	C	0.5	2	8.91	0.331	67
Pt	Front	C	0.4	1	21.40	0.245	67
Ti	Front	C	5.0	4	4.50	0.628	67
Ag	Rear	C	10.0	2	10.50	0.529	67
Al	Rear	C	10.0	1	2.70	1.080	53
Ge	Rear	C	10.0	3	5.35	0.516	80
Pd	Rear	C	0.9	4	12.038	0.357	48