NanoFab Process Group

This page lists various processes used internally by the NanoFab Process Group.

Dicing Procedures

Photoresist Application, Cleaning and Shipping

• PR Spin for Dicing Protect - ~800nm thick PR only (UV6)
• PR Clean of UV-6
• Shipping on fresh/new Dicing Tape+Frame

Dicing Alignment Mark Exposure

For providing alignment marks to use while dicing.

• ASML Stepper #3: Dicing Alignment Guides
  • How to program the ASML to shoot some alignment markers for use during dicing.

Process Control Calibration Procedures

Etching Tools

• Unaxis PM1: Indium Phosphide Etch Verification Procedure
• ICP#1/2: SiO2 Etch Verification Procedure
• PlasmaTherm SLR: SiO2 Etch Verification Procedure
• PlasmaTherm DSEiii: Si Etch Verification Procedure

Deposition Tools

• PECVD#1: Process Verification Procedure
• PECVD#2: Process Verification Procedure
• Unaxis PM3: Process Verification Procedure
• Veeco IBD: Process Verification Procedure