RIE Etching Recipes: Difference between revisions

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(→‎Photoresist and ARC: added tool name to header title)
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== Photoresist and ARC (RIE 5) ==
== Photoresist and ARC (RIE 5) ==


=== DUV42P (AR2) etching: ===
=== DUV42P (AR2) etching ===
* O2 = 20sccm // Pressure = 10mT // RF = 100W // Time = 40 sec
* O2 = 20sccm // Pressure = 10mT // RF = 100W // Time = 40 sec
* No need to pump/purge, can etch right away.
* No need to pump/purge, can etch right away.

Revision as of 17:02, 14 June 2021