Dicing Saw (ADT): Difference between revisions
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|type = Packaging |
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|location=Dicing Room: ESB 1147 |
|location=Dicing Room: ESB 1147 |
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|description = ADT Dicing Saw |
|description = ADT Dicing Saw |
Revision as of 16:08, 20 July 2021
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About
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.
Contact the tool supervisor for blades and dicing frames for your group.
Detailed Specifications
Operating Procedures
- Setting up the Saw before Cutting
- Standard Dicing Procedure - Programmed Cut Map
- Standard Dicing Procedure - Single Cuts
- Recovering an Old Recipe
Recipes
- Recipes > Packaging > Dicing Saw Recipes (ADT 7100)
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.