Mike Silva: Difference between revisions

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*[[High Temp Oven (Blue M)]]
*[[Sputter 5 (Lesker AXXIS)]]
*[[Ion Beam Deposition (Veeco NEXUS)]]
*[[ICP Etch 2 (Panasonic E640)]]
*[[Plasma Clean (Gasonics 2000)]]
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*[[HF Vapor Etch]]
*[[HF Vapor Etch]]
* [[Tube Furnace Wafer Bonding (Thermco)]]
* [[Step Profilometer (Dektak 6M)]]
* [[Step Profilometer (Dektak 6M)]]
* [[Film Stress (Tencor Flexus)]]
* [[Optical Film Thickness (Nanometric)]]
* [[Optical Film Thickness (Nanometric)]]
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Revision as of 18:26, 27 October 2021

Mike Silva
Position Equipment Engineering Manager
Room Number 1109B
Phone (805) 893-3096
Cell (805) 245-9356
E-Mail silva@ece.ucsb.edu


About

Information to come.

Current Work

Information to come.

Tools

Mike Silva is in charge of the following tools: