Chemical-Mechanical Polisher (Logitech): Difference between revisions
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{{tool2|{{PAGENAME}} |
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|picture=CMP.jpg |
|picture=CMP.jpg |
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|type = Dry Etch |
|type = Dry Etch |
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|super= |
|super= Bill Millerski |
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|super2= Don Freeborn |
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|phone=(805)839-3918x216 |
|phone=(805)839-3918x216 |
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|location=Bay 5 |
|location=Bay 5 |
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|toolid=50 |
|toolid=50 |
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}} |
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=About= |
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The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system. |
The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system. |
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Several slurries and pads are available to provide a range of polishing options depending on the material being processed. Pieces can also be handled on the system by wax-mounting with the [[Wafer Bonder (Logitech WBS7)|Logitech Bonder]]. |
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Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications. |
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=[[Instructions]]= |
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https://wiki.nanotech.ucsb.edu/w/images/c/c0/CMP.pdf |
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Latest revision as of 18:03, 30 August 2022
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About
The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system.
Several slurries and pads are available to provide a range of polishing options depending on the material being processed. Pieces can also be handled on the system by wax-mounting with the Logitech Bonder.
Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications.