Automated Coat/Develop System (S-Cubed Flexi): Difference between revisions

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(indicated which PR's/chems are availabelf for general use)
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''This Tool is now available for training - please contact the supervisor. 2022-11-01''
⚫
'''THIS TOOL IS ONLY FOR STAFF USE AT THIS TIME.'''


=About=
=About=
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**< 100 particles on 100mm wafer
**< 100 particles on 100mm wafer
*Photoresists/Underlayers Available:
*Photoresists/Underlayers Available:
**UV6-0.8
**UV6-0.8
**DS-K101-304
**DS-K101-304
⚫
**PMMA - '''<u>NOT FOR PUBLIC USE AT THIS TIME</u>'''
**PMMA
**PMGI SF11 - '''<u>NOT FOR GENERAL USE AT THIS TIME</u>'''
**PMGI SF11
**PMGI SF5 - '''<u>NOT FOR GENERAL USE AT THIS TIME</u>'''
**PMGI SF5
*Solvents Available:
*Solvents Available:
**EBR100
**EBR100 (wafer backside cleaning)
*Developers Available:
*Developers Available:
**AZ 300 MiF - '''<u>NOT FOR GENERAL USE AT THIS TIME</u>'''
**AZ 300 MiF


=Process Information=
=Process Information=
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=Operating Procedures=
=Operating Procedures=


*[[S-Cubed Flexi - Operating Procedure|Standard Operating Procedure]] - For running pre-written recipes only.
**[[S-Cubed Flexi - Operating Procedure|Standard Operating Procedure]] - For running pre-written recipes only.

Revision as of 21:19, 8 November 2022

Automated Coat/Develop System (S-Cubed Flexi)
TBD.jpg
Location Bay 7
Tool Type Wet Processing
Manufacturer S-Cubed
Model Flexi (Custom)
Description Automatic Coat/Bake/Develop
Primary Supervisor Tony Bosch
(805) 893-3486
bosch@ece.ucsb.edu

Secondary Supervisor

Lee Sawyer

Recipes Wet Processing Recipes
SignupMonkey: Sign up for this tool 


This Tool is now available for training - please contact the supervisor. 2022-11-01

About

The S3-Coater is a Coater/Developer system that has one photoresist spinner, one developer spinner and 4 hotplates each with independent temperature control and a chill plate. A central robot picks your wafer/s from one of 2 cassettes, processes them and returns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination, and coats photoresists with low particle counts/streaks and high uniformity.

At this time only full size substrates are allowed on this system. The S3 Coater is still in process development and not open for general use.

Detailed Specifications

  • Wafer Size: 100mm (150mm possible but not set up)
  • PR Coating Properties:
    • Uniformity < 1.0%
    • < 100 particles on 100mm wafer
  • Photoresists/Underlayers Available:
    • UV6-0.8
    • DS-K101-304
    • PMMA - NOT FOR PUBLIC USE AT THIS TIME
    • PMGI SF11 - NOT FOR GENERAL USE AT THIS TIME
    • PMGI SF5 - NOT FOR GENERAL USE AT THIS TIME
  • Solvents Available:
    • EBR100 (wafer backside cleaning)
  • Developers Available:
    • AZ 300 MiF - NOT FOR GENERAL USE AT THIS TIME

Process Information

Operating Procedures

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