Mike Silva: Difference between revisions
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{{staff|{{PAGENAME}} |
{{staff|{{PAGENAME}} |
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|position = |
|position = Equipment Engineering Manager |
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|room = |
|room = 1109B |
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|phone = (805) |
|phone = (805) 893-3096 |
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|cell = |
|cell = (805) 245-9356 |
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|email = silva@ece.ucsb.edu |
|email = silva@ece.ucsb.edu |
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}} |
}} |
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=About= |
=About= |
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Information to come. |
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=Current Work= |
=Current Work= |
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Information to come. |
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=Tools= |
=Tools= |
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*[[Sputter 5 (Lesker AXXIS)]] |
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*[[PECVD 2 (Advanced Vacuum)]] |
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*[[Thermal Evap 1]] |
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*[[Ion Beam Deposition (Veeco NEXUS)]] |
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*[[ICP Etch 2 (Panasonic E640)]] |
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*[[Plasma Clean (Gasonics 2000)]] |
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*[[HF Vapor Etch]] |
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* [[Tube Furnace Wafer Bonding (Thermco)]] |
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* [[Step Profile (Dektak IIA)]] |
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* [[Step Profilometer (Dektak 6M)]] |
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* [[Ellipsometer (Rudolph)]] |
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* [[Tencor Flexus Film Stress]] |
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* [[Optical Film Thickness (Nanometric)]] |
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Latest revision as of 15:31, 14 April 2023
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About
Information to come.
Current Work
Information to come.
Tools
Mike Silva is in charge of the following tools: