NanoFab Process Group: Difference between revisions

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''This page lists various processes used internally by the [https://wiki.nanotech.ucsb.edu/wiki/index.php?title=Staff_List#Process_Group NanoFab Process Group].''
''This page lists various processes used internally by the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Staff_List#Process_Group NanoFab Process Group].''


== Dicing Procedures ==
==Dicing Procedures==


=== Photoresist Application, Cleaning and Shipping ===
===Photoresist Application, Cleaning and Shipping===
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* [[ProcessGroup: PR Spin for Dicing Protect - UV6|PR Spin for Dicing Protect]] - ~800nm thick PR only (UV6)
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* [[ProcessGroup: PR Clean of UV-6|PR Clean of UV-6]]
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* [[ProcessGroup: Shipping Samples on Dicing Tape+Frame|Shipping Samples on Dicing Tape+Frame]]


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*[[ProcessGroup: PR Spin for Dicing Protect - UV6|PR Spin for Dicing Protect]] - ~800nm thick PR only (UV6)
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=== Dicing Alignment Mark Exposure ===
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*[[ProcessGroup: PR Clean of UV-6|PR Clean of UV-6]]
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*[[ProcessGroup: Shipping Samples on Dicing Tape+Frame|Shipping Samples on Dicing Tape+Frame]]

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===Dicing Alignment Mark Exposure===
''For providing alignment marks to use while dicing.''
''For providing alignment marks to use while dicing.''
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* [[ProcessGroup: ASML Stepper 3: Dicing Alignment Guides|ASML Stepper #3: Dicing Alignment Guides]]
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** ''How to program the ASML to shoot some alignment markers for use during dicing.''


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*[[ProcessGroup: ASML Stepper 3: Dicing Alignment Guides|ASML Stepper #3: Dicing Alignment Guides]]
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== Process Control Calibration Procedures ==
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**''How to program the ASML to shoot some alignment markers for use during dicing.''

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==Process Control Calibration Procedures==

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===Etching Tools===

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*[[ProcessGroup: Unaxis PM1: Indium Phosphide Etch Verification procedure|Unaxis PM1: Indium Phosphide Etch Verification Procedure]]
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*[[ProcessGroup: ICP|ICP#1/2: SiO2 Etch Verification Procedure]]
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*[[ProcessGroup: PlasmaTherm SLR: SiO2 Etch Verification Procedure|PlasmaTherm SLR: SiO2 Etch Verification Procedure]]
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*[[ProcessGroup: PlasmaTherm DSEiii: Si Etch Verification Procedure|PlasmaTherm DSEiii: Si Etch Verification Procedure]]

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===Deposition Tools===

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*[[ProcessGroup: PECVD|PECVD#1: Process Verification Procedure]]
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*[[ProcessGroup: PECVD|PECVD#2: Process Verification Procedure]]
*[[ProcessGroup: Unaxis PM3 Process Verification Procedure|Unaxis PM3: Process Verification Procedure]]
*[[ProcessGroup: IBD Process Verification Procedure|Veeco IBD: Process Verification Procedure]]

==Equipment Calibration Procedures==


=== Etching Tools ===
===Lithography Tools===
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* [[ProcessGroup: Unaxis PM1: Indium Phosphide Etch Verification procedure|Unaxis PM1: Indium Phosphide Etch Verification Procedure]]
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* [[ProcessGroup: ICP|ICP#1/2: SiO2 Etch Verification Procedure]]
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* [[ProcessGroup: PlasmaTherm SLR: SiO2 Etch Verification Procedure|PlasmaTherm SLR: SiO2 Etch Verification Procedure]]
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* [[ProcessGroup: PlasmaTherm DSEiii: Si Etch Verification Procedure|PlasmaTherm DSEiii: Si Etch Verification Procedure]]


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*[[ProcessGroup: GCA 6300 Stepper|GCA 6300 Stepper #1: Calibration Procedure]]
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=== Deposition Tools ===
* [[ProcessGroup: PECVD|PECVD#1: Process Verification Procedure]]
*[[ProcessGroup: GCA AutoStep 200, Stepper|GCA AutoStep 200, Stepper #2: Calibration procedure]]
* [[ProcessGroup: PECVD|PECVD#2: Process Verification Procedure]]
*[[ProcessGroup: ASML 5500 Stepper|ASML 5500 Stepper#3: Calibration Verification/Update procedure]]
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* [[ProcessGroup: Unaxis PM3 Process Verification Procedure|Unaxis PM3: Process Verification Procedure]]
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* [[ProcessGroup: IBD Process Verification Procedure|Veeco IBD: Process Verification Procedure]]


== Equipment Calibration Procedures ==
== Examples for Users ==
Example of Job Organization, Data Organization, Travelers and Design of Experiements for users.


* [https://trello.com/invite/b/Oxs8nMlt/ATTIcb107c9120edae48f4ba24b401e083339096A145/example-jobs-board Example Trello task tracking board], and the corresponding:
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=== Lithography Tools ===
* [https://drive.google.com/drive/folders/19N4LyL9eba5DHeaWObbQFAlkFSTQSBA8?usp=sharing Google Drive folder], linked from the above cards, containing travelers, 'fab data etc.
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* [[ProcessGroup: GCA 6300 Stepper|GCA 6300 Stepper #1: Calibration Procedure]]
* [[ProcessGroup: GCA AutoStep 200, Stepper|GCA AutoStep 200, Stepper #2: Calibration procedure]]
* [[ProcessGroup: ASML 5500 Stepper|ASML 5500 Stepper#3: Calibration Verification/Update procedure]]

Latest revision as of 23:46, 11 September 2023

This page lists various processes used internally by the NanoFab Process Group.

Dicing Procedures

Photoresist Application, Cleaning and Shipping

Dicing Alignment Mark Exposure

For providing alignment marks to use while dicing.

Process Control Calibration Procedures

Etching Tools

Deposition Tools

Equipment Calibration Procedures

Lithography Tools

Examples for Users

Example of Job Organization, Data Organization, Travelers and Design of Experiements for users.

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