Surface Analysis (KLA/Tencor Surfscan): Difference between revisions

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==About==
==About==
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface.

It can scan wafers in size from 4 to 8 inches. Piece-parts are more difficult but can be scanned with a custom recipe.

4-inch wafers are the most standard size to measure.

For measuring very low particle counts accurately, purchase "low particle count" (LPC) wafers from a Silicon wafer vendor, and keep the wafers in the case and clean at all times until use.


==Documentation==
==Documentation==


=== Operating Procedures ===
===Operating Procedures===


*[https://wiki.nanofab.ucsb.edu/w/images/0/04/SURFSCAN_6200_8inch_wafers.pdf Surfscan 6200 8inch wafers] *
*[https://wiki.nanofab.ucsb.edu/w/images/0/04/SURFSCAN_6200_8inch_wafers.pdf Surfscan 6200 8inch wafers] *
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*[https://wiki.nanofab.ucsb.edu/w/images/8/87/SURFSCAN_6200_4inch_wafers.pdf Surfscan 6200 4inch wafers] *
*[https://wiki.nanofab.ucsb.edu/w/images/8/87/SURFSCAN_6200_4inch_wafers.pdf Surfscan 6200 4inch wafers] *
*[https://wiki.nanofab.ucsb.edu/w/images/1/1a/SURFSCAN_6200_2_and_3inch_wafers.pdf Surfscan 6200 2 and 3inch wafers] *
*[https://wiki.nanofab.ucsb.edu/w/images/1/1a/SURFSCAN_6200_2_and_3inch_wafers.pdf Surfscan 6200 2 and 3inch wafers] *
**''You must provide your own 2/3-inch Cassette.''
*[https://wiki.nanofab.ucsb.edu/w/images/4/4e/SURFSCAN_6200_Small_substrates.pdf Surfscan 6200 Small samples] *
*[https://wiki.nanofab.ucsb.edu/w/images/4/4e/SURFSCAN_6200_Small_substrates.pdf Surfscan 6200 Small samples] *
**''You must water-mount your pieces to a 4-inch wafer.''
*[[Wafer scanning process traveler]]
*[[Wafer scanning process traveler|Wafer Particle Count - Process Traveler]]
**''This is the procedure Staff uses to calibrate particle counts on our deposition tools.''
**''This is the procedure Staff uses to calibrate particle counts on our deposition tools.''


=== Other Documentation ===
===Other Documentation===


* [https://wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual]
*[https://wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual]
**''For detailed measurement info, it is highly recommended that you read the manual.''
**''For detailed measurement info, it is highly recommended that you read the manual.''


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==Examples==
==Examples==
<br />
{| class="wikitable"
{| class="wikitable"
|+A low-particle 4-inch wafer example:
|+A low-particle 4-inch wafer example:

Revision as of 18:43, 4 January 2024

Surface Analysis (KLA/Tencor Surfscan)
Location Bay 5
Tool Type Inspection, Test and Characterization
Manufacturer Tencor
Description Surface Analysis
KLA/Tencor Surfscan

Primary Supervisor Biljana Stamenic
(805) 893-4002
biljana@ece.ucsb.edu

Secondary Supervisor

Don Freeborn


Recipes


About

This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface.

It can scan wafers in size from 4 to 8 inches. Piece-parts are more difficult but can be scanned with a custom recipe.

4-inch wafers are the most standard size to measure.

For measuring very low particle counts accurately, purchase "low particle count" (LPC) wafers from a Silicon wafer vendor, and keep the wafers in the case and clean at all times until use.

Documentation

Operating Procedures

Other Documentation

  • Operations Manual
    • For detailed measurement info, it is highly recommended that you read the manual.

Examples

A low-particle 4-inch wafer example:
Gain 4: Small Particles

(0.160µm – 1.60µm)

Gain 2: Large Particles

(1.60µm – 28.0µm)

A high-particle 4-inch wafer example:
Gain 4: Small Particles

(0.160µm – 1.60µm)

Gain 2: Large Particles

(1.60µm – 28.0µm)