Automated Coat/Develop System (S-Cubed Flexi): Difference between revisions

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{{tool|{{PAGENAME}}
{{tool2|{{PAGENAME}}
|picture=TBD.jpg
|picture=TBD.jpg
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|type = Lithography
|super= Tony Bosch
|super= Tony Bosch
|super2= Lee Sawyer
|location=Bay 7
|location=Bay 7
|description = Automatic Coat/Bake/Develop
|description = Automatic Coat/Bake/Develop
|manufacturer = S-Cubed
|manufacturer = [https://www.s-cubed.com S-Cubed]
|model = Flexi (Custom)
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|materials =
|type = Wet Processing
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|toolid=
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|recipe = Lithography
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}}
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|materials =
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=About=
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|toolid=67
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}}
''This Tool is now available for training - please contact the [[Tony Bosch|supervisor]]. 2022-11-01''


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==About==
''To Be Added''


The S3-Coater is a Coater/Developer system that has one photoresist spinner, one developer spinner and 4 hotplates each with independent temperature control and a chill plate. A central robot picks your wafer/s from one of 2 cassettes, processes them and returns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination, and coats photoresists with low particle counts/streaks and high uniformity.
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=Detailed Specifications=


Only full size 4-inch (100mm) substrates are allowed on this system.
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* Wafer Size:
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* Photoresists/Underlayers Available:
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* Solvents Available:
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* Developers Available:


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==Detailed Specifications==
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=Process Information=


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*Wafer Size: 100mm
* TBD
*PR Coating Properties:
**Uniformity < 1.0%
**< 100 particles on 100mm wafer
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*Photoresists/Underlayers Available:
**[https://wiki.nanofab.ucsb.edu/w/images/3/38/UV6-Positive-Resist-Datasheet.pdf UV6-0.8] - DUV Positive imaging resist
**[[Stepper Recipes#DS-K101-304|DS-K101-304]] - DUV bottom anti-reflection layer (BARC).
**PMMA - '''<u>NOT FOR PUBLIC USE AT THIS TIME</u>'''
**PMGI SF11 - '''<u>NOT FOR PUBLIC USE AT THIS TIME</u>'''
**PMGI SF5 - '''<u>NOT FOR PUBLIC USE AT THIS TIME</u>'''
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*Solvents Available:
**EBR100 (wafer backside cleaning)
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*Developers Available:
**[https://wiki.nanofab.ucsb.edu/w/images/f/f0/AZ300MIF-Developer-Datasheet.pdf AZ 300 MiF] - ''now available to use! (2024-07)''
*Hotplates Available:
**135°C - for UV6 soft-bake and Post-Exposure Bake
**220°C - for DSK101 BARC soft-bake - dry etchable
**185*C - for DSK101 BARC soft-bake - developable for undercut


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==Process Information==
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=Operating Procedures=


*Recipe Page for S-Cubed Coater: [[Lithography Recipes#Automated%20Coat.2FDevelop%20System%20Recipes%20.28S-Cubed%20Flexi.29|Lithography Recipes > Automated Coat/Develop System Recipes (S-Cubed Flexi]])
* TBD
*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Photolith. Chemicals page] for info on the installed resists.

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==Operating Procedures==

*[[S-Cubed Flexi - Operating Procedure|Standard Operating Procedure]] - For running pre-written recipes only.

==Recipes==

*'''Recipes > Lithography >''' [[Lithography Recipes#Automated Coat.2FDevelop System Recipes .28S-Cubed Flexi.29|'''<u>Automated Coater Recipes</u>''']] - See all available spin-coat recipes for this machine. Only Staff may edit/create recipes.

Latest revision as of 18:03, 3 September 2024

Automated Coat/Develop System (S-Cubed Flexi)
TBD.jpg
Location Bay 7
Tool Type Wet Processing
Manufacturer S-Cubed
Model Flexi (Custom)
Description Automatic Coat/Bake/Develop
Primary Supervisor Tony Bosch
(805) 893-3486
bosch@ece.ucsb.edu

Secondary Supervisor

Lee Sawyer

Recipes Wet Processing Recipes
SignupMonkey: Sign up for this tool 


This Tool is now available for training - please contact the supervisor. 2022-11-01

About

The S3-Coater is a Coater/Developer system that has one photoresist spinner, one developer spinner and 4 hotplates each with independent temperature control and a chill plate. A central robot picks your wafer/s from one of 2 cassettes, processes them and returns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination, and coats photoresists with low particle counts/streaks and high uniformity.

Only full size 4-inch (100mm) substrates are allowed on this system.

Detailed Specifications

  • Wafer Size: 100mm
  • PR Coating Properties:
    • Uniformity < 1.0%
    • < 100 particles on 100mm wafer
  • Photoresists/Underlayers Available:
    • UV6-0.8 - DUV Positive imaging resist
    • DS-K101-304 - DUV bottom anti-reflection layer (BARC).
    • PMMA - NOT FOR PUBLIC USE AT THIS TIME
    • PMGI SF11 - NOT FOR PUBLIC USE AT THIS TIME
    • PMGI SF5 - NOT FOR PUBLIC USE AT THIS TIME
  • Solvents Available:
    • EBR100 (wafer backside cleaning)
  • Developers Available:
  • Hotplates Available:
    • 135°C - for UV6 soft-bake and Post-Exposure Bake
    • 220°C - for DSK101 BARC soft-bake - dry etchable
    • 185*C - for DSK101 BARC soft-bake - developable for undercut

Process Information

Operating Procedures

Recipes

  • Recipes > Lithography > Automated Coater Recipes - See all available spin-coat recipes for this machine. Only Staff may edit/create recipes.
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