Automated Coat/Develop System (S-Cubed Flexi): Difference between revisions

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{{tool|{{PAGENAME}}
{{tool2|{{PAGENAME}}
|picture=TBD.jpg
|picture=TBD.jpg
|super= Tony Bosch
|super= Tony Bosch
|super2= Lee Sawyer
|location=Bay 7
|location=Bay 7
|description = Automatic Coat/Bake/Develop
|description = Automatic Coat/Bake/Develop
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|toolid=67
|toolid=67
}}
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''This Tool is now available for training - please contact the [[Tony Bosch|supervisor]]. 2022-11-01''
⚫
'''THIS TOOL IS ONLY FOR STAFF USE AT THIS TIME.'''


=About=
==About==


The S3 is a Coater/Developer system that has 4 hotplate each with independent temperature control and a chill plate. A central robot picks your wafer/s from a cassette, processes them and returns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination. At this time only full size substrates are allowed on this system. The S3 Coater is still in process development and not open for general use.
The S3-Coater is a Coater/Developer system that has one photoresist spinner, one developer spinner and 4 hotplates each with independent temperature control and a chill plate. A central robot picks your wafer/s from one of 2 cassettes, processes them and returns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination, and coats photoresists with low particle counts/streaks and high uniformity.


Only full size 4-inch (100mm) substrates are allowed on this system.
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=Detailed Specifications=


⚫
==Detailed Specifications==
*Wafer Size: 100mm (150mm possible but not set up)

*Wafer Size: 100mm
*PR Coating Properties:
*PR Coating Properties:
**Uniformity < 1.0%
**Uniformity < 1.0%
**< 100 particles on 100mm wafer
**< 100 particles on 100mm wafer
*Photoresists/Underlayers Available:
*Photoresists/Underlayers Available:
**[https://wiki.nanofab.ucsb.edu/w/images/3/38/UV6-Positive-Resist-Datasheet.pdf UV6-0.8] - DUV Positive imaging resist
**UV6-0.8
**[[Stepper Recipes#DS-K101-304|DS-K101-304]] - DUV bottom anti-reflection layer (BARC).
**DS-K101-304
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**PMMA - '''<u>NOT FOR PUBLIC USE AT THIS TIME</u>'''
**PMMA
**PMGI SF11 - '''<u>NOT FOR PUBLIC USE AT THIS TIME</u>'''
**PMGI SF11
**PMGI SF5 - '''<u>NOT FOR PUBLIC USE AT THIS TIME</u>'''
**PMGI SF5
*Solvents Available:
*Solvents Available:
**EBR100
**EBR100 (wafer backside cleaning)
*Developers Available:
*Developers Available:
**[https://wiki.nanofab.ucsb.edu/w/images/f/f0/AZ300MIF-Developer-Datasheet.pdf AZ 300 MiF] - ''now available to use! (2024-07)''
**AZ 300 MiF
*Hotplates Available:
**135°C - for UV6 soft-bake and Post-Exposure Bake
**220°C - for DSK101 BARC soft-bake - dry etchable
**185*C - for DSK101 BARC soft-bake - developable for undercut


=Process Information=
==Process Information==


*Recipe Page for S-Cubed Coater: [[Lithography Recipes#Automated%20Coat.2FDevelop%20System%20Recipes%20.28S-Cubed%20Flexi.29|Lithography Recipes > Automated Coat/Develop System Recipes (S-Cubed Flexi]])
*Recipe Page for S-Cubed Coater: [[Lithography Recipes#Automated%20Coat.2FDevelop%20System%20Recipes%20.28S-Cubed%20Flexi.29|Lithography Recipes > Automated Coat/Develop System Recipes (S-Cubed Flexi]])
*See the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Photolith. Chemicals page] for info on the installed resists.
*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Photolith. Chemicals page] for info on the installed resists.

⚫
==Operating Procedures==

*[[S-Cubed Flexi - Operating Procedure|Standard Operating Procedure]] - For running pre-written recipes only.


==Recipes==
⚫
=Operating Procedures=


*'''Recipes > Lithography >''' [[Lithography Recipes#Automated Coat.2FDevelop System Recipes .28S-Cubed Flexi.29|'''<u>Automated Coater Recipes</u>''']] - See all available spin-coat recipes for this machine. Only Staff may edit/create recipes.
*''To Be Added''

Latest revision as of 18:03, 3 September 2024

Automated Coat/Develop System (S-Cubed Flexi)
TBD.jpg
Location Bay 7
Tool Type Wet Processing
Manufacturer S-Cubed
Model Flexi (Custom)
Description Automatic Coat/Bake/Develop
Primary Supervisor Tony Bosch
(805) 893-3486
bosch@ece.ucsb.edu

Secondary Supervisor

Lee Sawyer

Recipes Wet Processing Recipes
SignupMonkey: Sign up for this tool 


This Tool is now available for training - please contact the supervisor. 2022-11-01

About

The S3-Coater is a Coater/Developer system that has one photoresist spinner, one developer spinner and 4 hotplates each with independent temperature control and a chill plate. A central robot picks your wafer/s from one of 2 cassettes, processes them and returns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination, and coats photoresists with low particle counts/streaks and high uniformity.

Only full size 4-inch (100mm) substrates are allowed on this system.

Detailed Specifications

  • Wafer Size: 100mm
  • PR Coating Properties:
    • Uniformity < 1.0%
    • < 100 particles on 100mm wafer
  • Photoresists/Underlayers Available:
    • UV6-0.8 - DUV Positive imaging resist
    • DS-K101-304 - DUV bottom anti-reflection layer (BARC).
    • PMMA - NOT FOR PUBLIC USE AT THIS TIME
    • PMGI SF11 - NOT FOR PUBLIC USE AT THIS TIME
    • PMGI SF5 - NOT FOR PUBLIC USE AT THIS TIME
  • Solvents Available:
    • EBR100 (wafer backside cleaning)
  • Developers Available:
  • Hotplates Available:
    • 135°C - for UV6 soft-bake and Post-Exposure Bake
    • 220°C - for DSK101 BARC soft-bake - dry etchable
    • 185*C - for DSK101 BARC soft-bake - developable for undercut

Process Information

Operating Procedures

Recipes

  • Recipes > Lithography > Automated Coater Recipes - See all available spin-coat recipes for this machine. Only Staff may edit/create recipes.
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