Automated Coat/Develop System (S-Cubed Flexi): Difference between revisions
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|picture=TBD.jpg |
|picture=TBD.jpg |
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|super= Tony Bosch |
|super= Tony Bosch |
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|super2= Lee Sawyer |
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|location=Bay 7 |
|location=Bay 7 |
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|description = Automatic Coat/Bake/Develop |
|description = Automatic Coat/Bake/Develop |
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|toolid=67 |
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''This Tool is now available for training - please contact the [[Tony Bosch|supervisor]]. 2022-11-01'' |
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=About= |
==About== |
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The S3-Coater is a Coater/Developer system that has one photoresist spinner, one developer spinner and 4 hotplates each with independent temperature control and a chill plate. A central robot picks your wafer/s from one of 2 cassettes, processes them and returns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination, and coats photoresists with low particle counts/streaks and high uniformity. |
The S3-Coater is a Coater/Developer system that has one photoresist spinner, one developer spinner and 4 hotplates each with independent temperature control and a chill plate. A central robot picks your wafer/s from one of 2 cassettes, processes them and returns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination, and coats photoresists with low particle counts/streaks and high uniformity. |
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Only full size 4-inch (100mm) substrates are allowed on this system. |
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=Detailed Specifications= |
==Detailed Specifications== |
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*Wafer Size: 100mm |
*Wafer Size: 100mm |
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*PR Coating Properties: |
*PR Coating Properties: |
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**Uniformity < 1.0% |
**Uniformity < 1.0% |
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**< 100 particles on 100mm wafer |
**< 100 particles on 100mm wafer |
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*Photoresists/Underlayers Available: |
*Photoresists/Underlayers Available: |
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**[https://wiki.nanofab.ucsb.edu/w/images/3/38/UV6-Positive-Resist-Datasheet.pdf UV6-0.8] - DUV Positive imaging resist |
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**UV6-0.8 |
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**[[Stepper Recipes#DS-K101-304|DS-K101-304]] - DUV bottom anti-reflection layer (BARC). |
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**DS-K101-304 |
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**PMMA |
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**PMGI SF11 - '''<u>NOT FOR PUBLIC USE AT THIS TIME</u>''' |
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**PMGI SF11 |
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**PMGI SF5 - '''<u>NOT FOR PUBLIC USE AT THIS TIME</u>''' |
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**PMGI SF5 |
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*Solvents Available: |
*Solvents Available: |
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**EBR100 |
**EBR100 (wafer backside cleaning) |
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*Developers Available: |
*Developers Available: |
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**[https://wiki.nanofab.ucsb.edu/w/images/f/f0/AZ300MIF-Developer-Datasheet.pdf AZ 300 MiF] - ''now available to use! (2024-07)'' |
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**AZ 300 MiF |
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*Hotplates Available: |
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**135°C - for UV6 soft-bake and Post-Exposure Bake |
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**220°C - for DSK101 BARC soft-bake - dry etchable |
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**185*C - for DSK101 BARC soft-bake - developable for undercut |
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=Process Information= |
==Process Information== |
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*Recipe Page for S-Cubed Coater: [[Lithography Recipes#Automated%20Coat.2FDevelop%20System%20Recipes%20.28S-Cubed%20Flexi.29|Lithography Recipes > Automated Coat/Develop System Recipes (S-Cubed Flexi]]) |
*Recipe Page for S-Cubed Coater: [[Lithography Recipes#Automated%20Coat.2FDevelop%20System%20Recipes%20.28S-Cubed%20Flexi.29|Lithography Recipes > Automated Coat/Develop System Recipes (S-Cubed Flexi]]) |
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*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Photolith. Chemicals page] for info on the installed resists. |
*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Photolith. Chemicals page] for info on the installed resists. |
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=Operating Procedures= |
==Operating Procedures== |
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*[[S-Cubed Flexi - Operating Procedure|Standard Operating Procedure]] - For running pre-written recipes only. |
*[[S-Cubed Flexi - Operating Procedure|Standard Operating Procedure]] - For running pre-written recipes only. |
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==Recipes== |
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*'''Recipes > Lithography >''' [[Lithography Recipes#Automated Coat.2FDevelop System Recipes .28S-Cubed Flexi.29|'''<u>Automated Coater Recipes</u>''']] - See all available spin-coat recipes for this machine. Only Staff may edit/create recipes. |
Latest revision as of 18:03, 3 September 2024
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This Tool is now available for training - please contact the supervisor. 2022-11-01
About
The S3-Coater is a Coater/Developer system that has one photoresist spinner, one developer spinner and 4 hotplates each with independent temperature control and a chill plate. A central robot picks your wafer/s from one of 2 cassettes, processes them and returns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination, and coats photoresists with low particle counts/streaks and high uniformity.
Only full size 4-inch (100mm) substrates are allowed on this system.
Detailed Specifications
- Wafer Size: 100mm
- PR Coating Properties:
- Uniformity < 1.0%
- < 100 particles on 100mm wafer
- Photoresists/Underlayers Available:
- UV6-0.8 - DUV Positive imaging resist
- DS-K101-304 - DUV bottom anti-reflection layer (BARC).
- PMMA - NOT FOR PUBLIC USE AT THIS TIME
- PMGI SF11 - NOT FOR PUBLIC USE AT THIS TIME
- PMGI SF5 - NOT FOR PUBLIC USE AT THIS TIME
- Solvents Available:
- EBR100 (wafer backside cleaning)
- Developers Available:
- AZ 300 MiF - now available to use! (2024-07)
- Hotplates Available:
- 135°C - for UV6 soft-bake and Post-Exposure Bake
- 220°C - for DSK101 BARC soft-bake - dry etchable
- 185*C - for DSK101 BARC soft-bake - developable for undercut
Process Information
- Recipe Page for S-Cubed Coater: Lithography Recipes > Automated Coat/Develop System Recipes (S-Cubed Flexi)
- See the Photolith. Chemicals page for info on the installed resists.
Operating Procedures
- Standard Operating Procedure - For running pre-written recipes only.
Recipes
- Recipes > Lithography > Automated Coater Recipes - See all available spin-coat recipes for this machine. Only Staff may edit/create recipes.