Difference between revisions of "Template:Announcements"

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=====ProbeStation scheduled IT maintenance=====
 
The ProbeStation will be undergoing IT maintenance and will be unavailable on the following dates :
 
* 10-30-23
 
* 10-31-23
 
Please plan your work activities accordingly.
 
//[[User:Mehalana v|Vraj Mehalana]] 11:58, 17 October 2023 (PDT)
 
   
=====PECVD2 is UP=====
+
=====Stepper #3 (ASML DUV) - Tool down=====
  +
Wafer stage positioning laser is dying, Asml engineers will be on site Monday and Tuesday to repair. We have the replacement already on hand.
Initially it was planned to remove the hoist again to rebuild it to solve the leak.
 
   
  +
Unfortunately, we cannot initialize the stage at this time. System is down. // [[User:Mehalana v|Vraj Mehalana]] 18:36, 3 October 2024 (PDT)
The manufacturer is sending out a rebuild kit under warranty since it is a brand new hoist that is leaking.
 
When that arrives I will schedule another all day event to rebuild the hoist.
 
   
  +
=====MLA Service Complete=====
I cleaned up the leaked oil, checked oil level, and did an inspection of the tool.
 
  +
The FSE has completed their work.
System is back up and available for use.
 
//[[User:Mehalana v|Vraj Mehalana]] 11:11, 23 October 2023 (PDT)
 
=====Unaxis ICP-PECVD is UP for Non-GapFill=====
 
Tool is up for NON-GapFill (450W RF Bias) Recipes. Other Std SiO2/SiN deps are available.
 
Next Week Monday Oct 16th to Wed 18th we will allow GapFill (450W RF Bias) recipes to be run.
 
Please plan your process accordingly.
 
Also we are still testing our own GapFill recipe that hopefully reduces flakes. Once this is ready you’ll want to qualify our new recipe to make sure it works for your application, as the old GapFill recipe will eventually be deprecated & disallowed.
 
   
  +
I ran beam offset checks on both lasers prior to the maintenance and found that the Y axis value for the 405 laser was off by ~0.6 µm. I made the necessary change and ran another check with all values in spec. I also ran beam offset checks on both laser post maintenance along with an overlay exposure and all looked good.
//[[User:Mehalana v|Vraj Mehalana]] 09:55, 11 October 2023 (PDT)
 
   
 
Tool is available to use.
=====Wafer Bonder, (Suss SB6-8E)=====
 
The top heater has failed. We are currently in the process of trying to source a new heater. we will send out an email once I have an update.
 
   
//[[User:Mehalana v|Vraj Mehalana]] 09:59, 20 September 2023 (PDT)
+
-Lee // [[User:John_d|Demis D. John]] 17:46, 2 October 2024 (PDT)
   
===== Dicing Saw Upgrade - Update=====
+
=====Suss SB6-8E=====
  +
When the vendor came in to install the new top heater he wasn't able to get the z-axis (elevator motor) to move. He was able to install the new heater and do a PM on the rest of the tool. We are ordering a new z-axis controller on the recommendation of the vendor. If all goes well this should solve the issue and make the bonder fully operational. I'll send out an email once the new controller has been installed.
The upgrade work on the saw is completed. My plan is to work on updating the SOP and running some more tests tomorrow and Monday. If all goes smoothly I should be ready to start re-training users on Tuesday, so I should be sending out an email some time Monday in regard to the re-training schedule.
 
   
  +
-Aidan
-Lee
 
 
//[[User:Mehalana v|Vraj Mehalana]] 12:43, 3 September 2024 (PDT)
   
  +
=====ICP1 Down=====
//[[User:Mehalana v|Vraj Mehalana]] 13:25, 3 October 2023 (PDT)
 
  +
The board we were waiting on arrived, but it did not resolve the tool issue. We are working with Panasonic on the next steps.
 
//[[User:Mehalana v|Vraj Mehalana]] 14:17, 1 March 2024 (PST)
   
===== EVG is down=====
+
=====Lab Access Changes: Symmetry App=====
  +
The iris scanner has been decommissioned. Please use the card reader which supports:
EVG finally has our PO. They are scheduled to be here next week, my guess would be Tuesday.
 
   
  +
-Physical card
-Lee
 
  +
  +
-Mobile phone via Symmetry App
  +
 
//[[User:Mehalana v|Vraj Mehalana]] 16:59, 14 June 2024 (PDT)
   
//[[User:Mehalana v|Vraj Mehalana]] 10:37, 18 October 2023 (PDT)
 
 
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Latest revision as of 18:36, 3 October 2024

Stepper #3 (ASML DUV) - Tool down

Wafer stage positioning laser is dying, Asml engineers will be on site Monday and Tuesday to repair. We have the replacement already on hand.

Unfortunately, we cannot initialize the stage at this time. System is down. // Vraj Mehalana 18:36, 3 October 2024 (PDT)

MLA Service Complete

The FSE has completed their work.

I ran beam offset checks on both lasers prior to the maintenance and found that the Y axis value for the 405 laser was off by ~0.6 µm. I made the necessary change and ran another check with all values in spec. I also ran beam offset checks on both laser post maintenance along with an overlay exposure and all looked good.

Tool is available to use.

-Lee // Demis D. John 17:46, 2 October 2024 (PDT)

Suss SB6-8E

When the vendor came in to install the new top heater he wasn't able to get the z-axis (elevator motor) to move. He was able to install the new heater and do a PM on the rest of the tool. We are ordering a new z-axis controller on the recommendation of the vendor. If all goes well this should solve the issue and make the bonder fully operational. I'll send out an email once the new controller has been installed.

-Aidan //Vraj Mehalana 12:43, 3 September 2024 (PDT)

ICP1 Down

The board we were waiting on arrived, but it did not resolve the tool issue. We are working with Panasonic on the next steps. //Vraj Mehalana 14:17, 1 March 2024 (PST)

Lab Access Changes: Symmetry App

The iris scanner has been decommissioned. Please use the card reader which supports:

-Physical card

-Mobile phone via Symmetry App

//Vraj Mehalana 16:59, 14 June 2024 (PDT)