Ion Beam Deposition (Veeco NEXUS): Difference between revisions

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(→‎Documentation: linked to sputtering recipes)
Line 37: Line 37:
=Documentation=
=Documentation=
*[[media:IBDInstructions.pdf|Operating Instructions]]
*[[media:IBDInstructions.pdf|Operating Instructions]]
*[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|Sputtering_Recipes: Ion Beam Deposition (Veeco NEXUS)]]
*[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|Sputtering Recipes: Ion Beam Deposition (Veeco NEXUS)]]

Revision as of 20:05, 13 August 2013

Ion Beam Deposition (Veeco NEXUS)
IBD.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Mike Silva
Supervisor Phone (805) 893-3096
Supervisor E-Mail silva@ece.ucsb.edu
Description Ion Beam Deposition Tool
Manufacturer Veeco
Vacuum Deposition Recipes
Sign up for this tool


About

This tool is designed for high quality, precise, reproducible deposition of dielectric films for optical quality films. Metallic material is ion bombarded from a target material and a reactive ion beam of oxygen and/or nitrogen is aimed at the surface, creating a metal-oxide or nitride on the sample. The system is fully computer controlled to facilitate multi-layer stack recipes for high reflectivity or low reflectivity coatings. The system is load locked and can handle wafers up to 6” in diameter as well as small pieces. Sample rotation and angling is used to facilitate material quality and allows for sidewall coverage on non-planar surfaces. Uniformity is better than 1.5% over 6" wafers and reproducibility is expected to be within one percent (with pre-dep calibration). The high-energy sputter deposition produces denser films than other techniques, improving optical damage threshold (and thus coating lifetime). This also causes the refractive indices to be slightly higher than comparable stoichiometric films deposited by other techniques.

Four metallic targets can be installed (producing Oxides & Nitrides of each). Ta & Si are always available, the others are rotated out as users need them.

The most common films for High-/Anti-Reflection (HR/AR) coatings are SiO2 & Ta2O5, both of which are extremely stable w/r/to refractive index. Users typically calibrate their dep. rates prior to critical deps. & multi-layer coatings.

Detailed Specifications

  • Xenon target bombardment
  • Nitrogen and/or Oxygen deposition assist source for metal oxides/nitrides
  • Targets: Ta, Si, Al, Ti, ITO
  • Pieces up to 6” wafers accepted
  • Full programmable control through GUI for multi-layer optical coatings
  • Standard Recipes: Ta2O5 (1.33 A/s rate), SiO2 (0.85A/s), Si3N4, TiO2.
    • Custom recipes: Al2O3, SiOxNy, AlN, TaN
  • Base Pressure ≤ 3e-8 Torr
  • High quality, High Reflectivity DBR (>99.5%) mirrors demonstrated in blue wavelengths
  • Wide-band Anti-Reflection coatings demonstrated in near-IR (~1550nm)

Documentation