ICP Etching Recipes: Difference between revisions
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*[[media:Panasonic1-SiO-Etch.pdf|SiO<sub>2</sub> Vertical Etch Recipe Parameters - CHF<sub>3</sub>]] |
*[[media:Panasonic1-SiO-Etch.pdf|SiO<sub>2</sub> Vertical Etch Recipe Parameters - CHF<sub>3</sub>]] |
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*[[media:Panasonic1-SiO2-Data-Process-Variation-CHF3-revA.pdf|SiO<sub>2</sub> CHF<sub>3</sub> Etch Variations]] |
*[[media:Panasonic1-SiO2-Data-Process-Variation-CHF3-revA.pdf|SiO<sub>2</sub> CHF<sub>3</sub> Etch Variations]] |
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==SiN<sub>x</sub> Etching (Panasonic 1)== |
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*[[media:Panasonic1-SiN-Etch-Plasma-CF4-O2-ICP-revA.pdf|SiN<sub>x</sub> Etch Rates and Variations - CF<sub>4</sub>]-O<sub>2</sub>] |
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==Al Etch (Panasonic 1)== |
==Al Etch (Panasonic 1)== |
Revision as of 22:04, 22 October 2013
Back to Dry Etching Recipes.
Si Deep RIE (PlasmaTherm/Bosch Etch)
Single-step Si Etching (not Bosch Process!) (Si Deep RIE)
ICP Etch 1 (Panasonic E626I)
SiO2 Etching (Panasonic 1)
SiNx Etching (Panasonic 1)
- [[media:Panasonic1-SiN-Etch-Plasma-CF4-O2-ICP-revA.pdf|SiNx Etch Rates and Variations - CF4]-O2]