Mike Silva: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
(→Tools) |
||
(5 intermediate revisions by the same user not shown) | |||
Line 1: | Line 1: | ||
{{staff|{{PAGENAME}} |
{{staff|{{PAGENAME}} |
||
|position = |
|position = Equipment Engineering Manager |
||
|room = 1109B |
|room = 1109B |
||
|phone = (805) |
|phone = (805) 893-3096 |
||
|cell = (805) |
|cell = (805) 245-9356 |
||
|email = silva@ece.ucsb.edu |
|email = silva@ece.ucsb.edu |
||
}} |
}} |
||
Line 18: | Line 18: | ||
|-valign="top" |
|-valign="top" |
||
| |
| |
||
*[[High Temp Oven (Blue M)]] |
|||
*[[Sputter 5 (Lesker AXXIS)]] |
|||
*[[Ion Beam Deposition (Veeco NEXUS)]] |
|||
*[[ICP Etch 2 (Panasonic E640)]] |
|||
*[[Plasma Clean (Gasonics 2000)]] |
|||
|| |
|| |
||
*[[HF Vapor Etch]] |
|||
* [[Tube Furnace Wafer Bonding (Thermco)]] |
|||
* [[Step Profilometer (Dektak 6M)]] |
|||
* [[Film Stress (Tencor Flexus)]] |
|||
* [[Optical Film Thickness (Nanometric)]] |
|||
|} |
|} |
Latest revision as of 15:31, 14 April 2023
|
About
Information to come.
Current Work
Information to come.
Tools
Mike Silva is in charge of the following tools: