Mechanical Polisher (Allied): Difference between revisions
Jump to navigation
Jump to search
No edit summary |
Millerski w (talk | contribs) (Added SOP Link) |
||
| (One intermediate revision by one other user not shown) | |||
| Line 1: | Line 1: | ||
{{ |
{{tool2|{{PAGENAME}} |
||
|picture=AlliedPolisher10-1110.jpg |
|picture=AlliedPolisher10-1110.jpg |
||
|type = Wet Processing |
|type = Wet Processing |
||
|super= Bill Millerski |
|super= Bill Millerski |
||
|location=ESB |
|location=ESB Rm. 1111 |
||
|description = Mechanical Polisher |
|description = Mechanical Polisher |
||
|manufacturer = Allied High Tech Products Inc. |
|manufacturer = Allied High Tech Products Inc. |
||
| Line 10: | Line 10: | ||
|toolid=70 |
|toolid=70 |
||
}} |
}} |
||
= |
=About= |
||
The Allied Polisher allows for bulk thinning of substrates, and fine polishing of optical waveguide facets. Various materials are typically lapped/polished, such as Silicon GaAs, InP. |
The Allied Polisher allows for bulk thinning of substrates, and fine polishing of optical waveguide facets. Various materials are typically lapped/polished, such as Silicon GaAs, InP. |
||
== |
==Detailed Specs== |
||
| ⚫ | |||
| ⚫ | |||
| ⚫ | |||
| ⚫ | |||
| ⚫ | |||
| ⚫ | |||
| ⚫ | |||
| ⚫ | |||
== Operating Procedures == |
|||
| ⚫ | |||
| ⚫ | |||
| ⚫ | |||
| ⚫ | |||
| ⚫ | |||
| ⚫ | |||
| ⚫ | |||
== |
==Operating Procedures== |
||
* ''To Be Added'' |
|||
*[https://wiki.nanotech.ucsb.edu/w/images/f/f2/Mechanical_Polisher_SOP_Rev_A.pdf Mechanical Polisher SOP] |
|||
==Recipes== |
|||
| ⚫ | |||
Latest revision as of 16:06, 15 May 2023
| ||||||||||||||||||||||||||||
About
The Allied Polisher allows for bulk thinning of substrates, and fine polishing of optical waveguide facets. Various materials are typically lapped/polished, such as Silicon GaAs, InP.
Detailed Specs
- Max. Substrate Size
- Lapping Films available:
- 10µm AlOx
- 5µm AlOx
- 2µm AlOx
- 1µm AlOx
- 0.5 AlOx
Operating Procedures
Recipes
- To Be Added