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=== CHIPS Act Award Announced to USC and UCSB NanoFab == |
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[https://carbajal.house.gov/news/documentsingle.aspx?DocumentID=1672 U.S. Congressman Salud Carbajal congratulates UCSB and the NanoFab] on receiving a [https://www.nist.gov/chips CHIPS & Science Act] award, as part of the [https://microelectronicscommons.org/ California DREAMS Hub (Microelectronics Commons) led by USC]. |
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=== Die-Bonder & Wirebonder Installed at Protofab === |
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We have installed a [https://protowiki.oasis.ucsb.edu/index.php/Flip-Chip_and_Die_Bonder_(Tresky_T-5300-W) new Tresky Flip-chip/Die-bonder] & [https://protowiki.oasis.ucsb.edu/index.php/Ball_%26_Wedge_Bonding_(F%26S_56i_Wire_Bonder) F&S Wirebonder] at the [https://protofab.oasis.ucsb.edu/ Protofab]. The wirebonder allows fast automatic wirebonding, capable of hundreds of wirebonds in minutes. The die-bonder enables solder bonding chips to carriers/PCB's and related capabilities. Contact staff at the above wiki pages for training. |
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Both SEM's have been replaced with new JEOL [[SEM_1_(JEOL_IT800SHL)|SEM's #1]] and [[Field_Emission_SEM_2_(JEOL_IT800SHL)|SEM #2]]. SEM#1 has the NABITY lithography system installed, and SEM #2 has always-on EDAX elemental analysis. Contact the [[Aidan_Hopkins|supervisor, Aidan Hopkins]], for more information. |
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// [[User: |
// [[User:John_d|Demis D. John]] 19:53, 3 October 2026 (UTC) |
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=== "Make Microchips!" - new book by Nanofab staff === |
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=== Wide FOV Microscope Installed === |
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Nanofab staff [[Demis D. John]] published an intro-level book for people wanting to learn about making microchips, it is [https://www.amazon.com/dp/B0HDRHG3KM '''available now on Amazon''']. The book compliments the [https://nanofab.ucsb.edu/workforce#bootcamps Cleanroom Bootcamps] and other [https://nanofab.ucsb.edu/workforce workforce development efforts] Demis has launched, to help people get into the semiconductor industry. |
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We have installed an AmScope stereo microscope in Bay 4 for wide field-of-view digital imaging/capture, with >2cm of FOV currently available. Wiki page here: [[Microscopes#Microscope_.238:_AmScope_Wide_Field_of_View_Stereoscope_.28Bay_4.29|AmScope Wide Field of View Stereoscope]] |
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// [[User: |
// [[User:John_d|Demis D. John]] 15:30, 22 August 2026 (UTC) |
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=== Carpinteria Highschool does Microchip Packaging === |
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The SB Chamber of Commerce sponsored Carpinteria Highschool to do microchip packaging using their machine shop in the CHIP program! Under the mentorship of Nanofab staff [[Demis D. John]] and Ben Werner from [https://www.pseudolithic.com/ PseudolithIC], 3 student teams designed the microchip packaging for micro-pressure sensors, MEMS chips made during the [https://nanofab.ucsb.edu/workforce#bootcamps CC-PRIME cleanroom bootcamps]. The SBSC Chamber released [https://sbscchamber.com/chip/ a video about the program here], you can learn more [https://innovation.ucsb.edu/blog/news/ucsb-partnership-opens-doors-semiconductor-careers-high-school-students at this article]. |
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We have installed a new [https://loomisinc.com/lsd-155lt/ Loomis LSD-155LT] Automated Scribe & Break Cleaving tool in the Back-End Processing lab. Qualifications are underway. Contact [[Aidan_Hopkins|supervisor, Aidan Hopkins]], for more information. |
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// [[User: |
// [[User:John_d|Demis D. John]] 10:00, 13 August 2026 (UTC) |
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=== Raith PicoMaster Direct-Write Installed === |
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We have installed a new H-Line (405nm) Direct-write tool: The [[Maskless_Aligner_(Raith_PicoMaster_XF)]]. The new tool is currently undergoing staff qualifications and we are developing operating procedures. // [[User:John_d|Demis D. John]] 19:02, 18 July 2026 (UTC) |
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We have replaced the old Dektak 6M with a new Dektak XT profilometer. This tool will provide robust, fast metrology for rapid in-process topography inspection. |
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// [[User:John d|John d]] 10:41, 25 January 2023 (PST) |
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===ProtoFab Opening Summer 2026=== |
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=== New Process Control data tables === |
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The Nanofab is launching a [https://protofab.oasis.ucsb.edu/ Prototyping Facility called the "Protofab"], which is located at [https://oasis.ucsb.edu/ UCSB's new OASIS building]. Learn more at [https://protofab.oasis.ucsb.edu https://protofab.oasis.ucsb.edu] |
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We have added [[Process_Group_-_Process_Control_Data|"Process Control Data"]] - data on deposition/etch repeatability - to a number of our highest used etchers and deposition tools. The datasheets are linked in multiple places, mainly on the Recipes pages for each tool, or on the general Recipes pages for [[Vacuum_Deposition_Recipes|'''Deposition Recipes''']] or [[Dry_Etching_Recipes|'''Etch Recipes''']]. |
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// [[User:John d|John d]] 16:07, 5 January 2023 (PST) |
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The new lab will enable taking your diced chips from the Nanofab, to the Protofab where you can wirebond, attach to PCB's/carriers, align+attach optical fibers etc., to make a real "prototype". The lab is expected to open in Summer 2026, with equipment currently being installed. |
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=== Oxford PlasmaPro ICP Etcher installed === |
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We have a new ICP etcher in Bay 2: |
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[[Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)]] |
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Access & model is similar to the Nanofab - anyone can pay an hourly fee to go into the Protofab, using key fobs for access. (OASIS "Membership" is ''not required'' to use the Protofab, unless you also want your own desk + private lab space at OASIS.) |
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The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.) |
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Contact the Protofab lab manager [mailto:arin_abed@ucsb.edu Arin Abed] for more information. |
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In addition, the tool is capable of Atomic Layer Etching on various materials. Contact [[Tony_Bosch | the supervisor]] for training. |
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// [[User: |
// [[User:John_d|Demis D. John]] 19:51, 27 May 2026 (UTC) |
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===CS MANTECH Poster: "Machine Matching Methodology for Single-shot Lab to Lab Dry Etch Process Transfer" === |
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=== SiO2 etching, High-Aspect Ratio === |
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Nanofab staff Foong Fatt, Noah Dutra and Brian Thibeault presented a poster at CS MANTECH (compound semiconductor manufacturing technology) in Portland Oregon. The paper describes using [https://www.pdf.com/products/exensio-analytics-platform/overview/ PDF Solutions Exensio analytics] to do a single-shot dry etch process transfer from the UCSB Nanofab's Oxford Cobra ICP etcher to a different-configuration ICP etcher at UC San Diego's, reproducing etch rate and sidewall profile in a single-shot. The technique used complimentary L9 DOE's at each site to map out the process space, allowing for single-shot matching. [[Media:2026_CSMANTECH_Paper-2366_-_Foong_Fatt_-_Machine_Matching_Methodology_for_Single-shot_Lab_to_Lab_Dry_Etch_Process_Transfer.pdf|See the full paper here]]. |
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[[Bill_Mitchell|Dr. Bill Mitchell]] recently published an article detailing [[Template:Publications#Highly_Selective_and_Vertical_Etch_of_Silicon_Dioxide_using_Ruthenium_Films_as_an_Etch_Mask|'''high-aspect ratio SiO2 etching (JVST-A, May 2021)''']] in the [[ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher|Plasma-Therm Fluorine ICP etcher]], using a novel Ruthenium Hard Mask. |
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// [[User:John_d|Demis D. John]] 15:53, 22 August 2026 (UTC) |
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===Video: Scalable R&D Tips from Nanofab Staff=== |
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Ruthenium can be deposited using the [[Atomic_Layer_Deposition_Recipes#Ru_deposition_.28ALD_CHAMBER_1.29|Oxford ALD]] or [[Sputtering_Recipes#Ru_Deposition_.28Sputter_4.29|AJA Sputter]] and etched in one of the [[ICP_Etching_Recipes#Ru_.28Ruthenium.29_Etch_.28Panasonic_2.29|Panasonic ICP's]]. |
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Demis D. John presented a seminar to the [https://ca-dreams.org/ CA DREAMS Microelectronics Commons Hub] detailing common methods and thought-processes for making novel, advanced microchips as fast and low-cost as possible. See the [https://www.youtube.com/watch?v=ENdgmvlbsU0 Seminar titled "Scalable Manufacturing in an R&D Lab: Supporting Startup/Research Success in a high-mix environment" on Youtube] |
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You can find a full process flow at the [[ICP_Etching_Recipes#SiO2_Etching_.28Fluorine_ICP_Etcher.29|FL-ICP's Recipe Page]], in this case using a Sputtered Ru hard mask and I-line stepper lithography. |
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// [[User:John d|John d]] 08:05, 27 May 2021 (PDT) |
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=== Wafer Polisher available === |
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We have added an [https://wiki.nanotech.ucsb.edu/wiki/Mechanical_Polisher_(Allied) Allied Wafer Polish] tool to our equipment list. Contact [[Bill_Millerski]] for more information. // [[User:John d|John d]] 16:49, 10 May 2021 (PDT) |
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=== Digital Microscope: Olympus DSX-1000 === |
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You'll see a new digital microscope in Bay 4/Metrology, that's our new [https://www.olympus-ims.com/en/microscope/dsx1000/high-resolution-model/ Olympus DSX-1000]. We are currently developing procedures, keep an eye out for training emails. |
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// [[User:John d|John d]] 13:49, 8 April 2021 (PDT) |
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=== Raith Velion: FIB/SEM Installation === |
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We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1. |
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The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography. |
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Learn more about the tool's capabilities at the Raith website: |
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* [https://www.raith.com/products/velion.html?mobile=0 Raith Products: Velion]. |
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* [https://www.youtube.com/watch?v=rW5w6nMhwfQ VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM] |
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Tool qualification is currently underway. |
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[[Dan Read|Dr. Dan Read]] is the resident expert on this new tool. |
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Latest revision as of 23:47, 3 October 2026
News from the U.C. Santa Barbara Nanofabrication Facility.
Die-Bonder & Wirebonder Installed at Protofab
We have installed a new Tresky Flip-chip/Die-bonder & F&S Wirebonder at the Protofab. The wirebonder allows fast automatic wirebonding, capable of hundreds of wirebonds in minutes. The die-bonder enables solder bonding chips to carriers/PCB's and related capabilities. Contact staff at the above wiki pages for training. // Demis D. John 19:53, 3 October 2026 (UTC)
"Make Microchips!" - new book by Nanofab staff
Nanofab staff Demis D. John published an intro-level book for people wanting to learn about making microchips, it is available now on Amazon. The book compliments the Cleanroom Bootcamps and other workforce development efforts Demis has launched, to help people get into the semiconductor industry. // Demis D. John 15:30, 22 August 2026 (UTC)
Carpinteria Highschool does Microchip Packaging
The SB Chamber of Commerce sponsored Carpinteria Highschool to do microchip packaging using their machine shop in the CHIP program! Under the mentorship of Nanofab staff Demis D. John and Ben Werner from PseudolithIC, 3 student teams designed the microchip packaging for micro-pressure sensors, MEMS chips made during the CC-PRIME cleanroom bootcamps. The SBSC Chamber released a video about the program here, you can learn more at this article. // Demis D. John 10:00, 13 August 2026 (UTC)
Raith PicoMaster Direct-Write Installed
We have installed a new H-Line (405nm) Direct-write tool: The Maskless_Aligner_(Raith_PicoMaster_XF). The new tool is currently undergoing staff qualifications and we are developing operating procedures. // Demis D. John 19:02, 18 July 2026 (UTC)
ProtoFab Opening Summer 2026
The Nanofab is launching a Prototyping Facility called the "Protofab", which is located at UCSB's new OASIS building. Learn more at https://protofab.oasis.ucsb.edu
The new lab will enable taking your diced chips from the Nanofab, to the Protofab where you can wirebond, attach to PCB's/carriers, align+attach optical fibers etc., to make a real "prototype". The lab is expected to open in Summer 2026, with equipment currently being installed.
Access & model is similar to the Nanofab - anyone can pay an hourly fee to go into the Protofab, using key fobs for access. (OASIS "Membership" is not required to use the Protofab, unless you also want your own desk + private lab space at OASIS.)
Contact the Protofab lab manager Arin Abed for more information. // Demis D. John 19:51, 27 May 2026 (UTC)
CS MANTECH Poster: "Machine Matching Methodology for Single-shot Lab to Lab Dry Etch Process Transfer"
Nanofab staff Foong Fatt, Noah Dutra and Brian Thibeault presented a poster at CS MANTECH (compound semiconductor manufacturing technology) in Portland Oregon. The paper describes using PDF Solutions Exensio analytics to do a single-shot dry etch process transfer from the UCSB Nanofab's Oxford Cobra ICP etcher to a different-configuration ICP etcher at UC San Diego's, reproducing etch rate and sidewall profile in a single-shot. The technique used complimentary L9 DOE's at each site to map out the process space, allowing for single-shot matching. See the full paper here. // Demis D. John 15:53, 22 August 2026 (UTC)
Video: Scalable R&D Tips from Nanofab Staff
Demis D. John presented a seminar to the CA DREAMS Microelectronics Commons Hub detailing common methods and thought-processes for making novel, advanced microchips as fast and low-cost as possible. See the Seminar titled "Scalable Manufacturing in an R&D Lab: Supporting Startup/Research Success in a high-mix environment" on Youtube // Demis D. John 02:13, 12 June 2026 (UTC)
See older articles at this link