Film Stress (Tencor Flexus)

Film Stress (Tencor Flexus) Tool Type Inspection, Test and Characterization Location Bay 4 Supervisor Lee Sawyer Supervisor Phone (805) 893-2123 Supervisor E-Mail lee_sawyer@ucsb.edu Description Film Stress Measurement system Manufacturer Tencor Model FLX-2320

About

The Flexus instrument is used to measure the stress introduced onto a wafer after thin-film deposition by measuring local curvature of a wafer. The system uses a scanning laser detector configuration to measure the surface position of a wafer across its diameter. With automatic rotational control, a 3-D map can also be obtained. By comparing before and after measurements of the sample, the local stress of the sample can be calculated from the local curvature. The stage can also be heated up to 500°C to measure thermal mismatch of the thin films with the substrate.

Equipment Specifications

• RT to 500°C operation
• Windows 3.xx control and file storing
• 3-D mapping
• 4" wafers
• Laser/Detector Scanning Configuration