Wafer Bonder (Logitech WBS7): Difference between revisions
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= About = |
== About == |
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This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax. This can be used for through-etching of the sample wafer, for dicing, or sometimes for lithography. |
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== Recipes == |
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* Recipes > Packaging Recipes > [https://www.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes#Wafer_Bonder_.28Logitech_WBS7.29 Wafer Bonder (Logitech WBS7)] |
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Revision as of 16:14, 16 October 2018
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About
This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax. This can be used for through-etching of the sample wafer, for dicing, or sometimes for lithography.
Detailed Specifications
Operation Procedures
Recipes
- Recipes > Packaging Recipes > Wafer Bonder (Logitech WBS7)