Ashers (Technics PEII): Difference between revisions
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= About = |
= About = |
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These two parallel plate plasma etching systems are generally used to clean organic residue off of semiconductor wafers (ashing), etch organic films, or etch Si<sub>3</sub>N<sub>4</sub> films. The systems are both equipped with O<sub>2</sub> for organic removal |
These two parallel plate plasma etching systems are generally used to clean organic residue off of semiconductor wafers (ashing), etch organic films, or etch Si<sub>3</sub>N<sub>4</sub> films. The systems are both equipped with O<sub>2</sub> for organic removal / surface activation. |
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One system also has CF<sub>4</sub>/O<sub>2</sub> 88% / 12% for etching Si<sub>3</sub>N<sub>4</sub>. These systems are operated manually and no sign-up is required. |
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=== Applications === |
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This is an RIE etch with O2 - using plasma ion bombardment, in a semi-vertical direction (although the higher 300mT pressure does attack sidewalls somewhat). |
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Low-temp (energy comes from ion acceleration, not temperature). |
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Use this for situation where the material to be removed is resistant to chemicals (fluorocarbon polymers - think "plastic") and/or relatively hard (chlorinated PR, after a CL2/BCl2 etch), so physical bombardment is necessary to break up the material, or if high-temp is not acceptable. |
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Stripping full-thickness PR's in the PEii is slow, at something like ~100nm/1min (at standard 100W/300mT). |
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Surface activation, eg. making the surface hydrophilic before water-based wet-etching (15sec). This is very important for wet-etch processing through small, high aspect ratio photoresist holes or lines. Or to increase adhesion of the next deposition (~1min) - etch is a bit more aggressive and will go through any monolayers (organic or otherwise). |
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= Detailed Specifications = |
= Detailed Specifications = |
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*Typical process conditions: |
*Typical process conditions: |
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**Ashing: O2 300mT, 100W power, 30 sec. |
**Ashing: O2 300mT, 100W power, 30 sec. |
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**Si3N4 Etching: CF<sub>4</sub>/O<sub>2</sub> 300mT, 100W, ~ |
**Si3N4 Etching: CF<sub>4</sub>/O<sub>2</sub> 300mT, 100W, ~ 100–150 nm / min. etch rate |
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Revision as of 17:16, 23 June 2021
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About
These two parallel plate plasma etching systems are generally used to clean organic residue off of semiconductor wafers (ashing), etch organic films, or etch Si3N4 films. The systems are both equipped with O2 for organic removal / surface activation.
One system also has CF4/O2 88% / 12% for etching Si3N4. These systems are operated manually and no sign-up is required.
Applications
This is an RIE etch with O2 - using plasma ion bombardment, in a semi-vertical direction (although the higher 300mT pressure does attack sidewalls somewhat).
Low-temp (energy comes from ion acceleration, not temperature).
Use this for situation where the material to be removed is resistant to chemicals (fluorocarbon polymers - think "plastic") and/or relatively hard (chlorinated PR, after a CL2/BCl2 etch), so physical bombardment is necessary to break up the material, or if high-temp is not acceptable.
Stripping full-thickness PR's in the PEii is slow, at something like ~100nm/1min (at standard 100W/300mT).
Surface activation, eg. making the surface hydrophilic before water-based wet-etching (15sec). This is very important for wet-etch processing through small, high aspect ratio photoresist holes or lines. Or to increase adhesion of the next deposition (~1min) - etch is a bit more aggressive and will go through any monolayers (organic or otherwise).
Detailed Specifications
- Gases used: CF4 / O2 (88%/12%) and O2
- ~ 10mT ultimate chamber pressure
- 100 kHz directly coupled excitation source
- Sample size: pieces to 6” wafers
- Gas flow and power control
- Typical process conditions:
- Ashing: O2 300mT, 100W power, 30 sec.
- Si3N4 Etching: CF4/O2 300mT, 100W, ~ 100–150 nm / min. etch rate