Dry Etching Recipes: Difference between revisions

Revision as of 22:59, 31 July 2020

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Dry Etching Recipes
	RIE Etching			ICP Etching					Oxygen Plasma Systems					Other Dry Etchers
Material	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	SLR Fluorine ICP (PlasmaTherm)	ICP Etch 1 (Panasonic 1)	ICP Etch 2 (Panasonic 2)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	Plasma Clean (YES EcoClean)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)
Ag																A
Al			A			R1	R1									A
Au																R1
Cr			A			R1	A									A
Cu																A
Ge														A		A
Mo																A
Ni																R1
Pt																R1
Ru						A	R1									A
Si				R1	R1									R1		A
Ta																A
Ti						R1	A									A
Al₂O₃							R									A
Al₂O_{3 (Sapphire)}						R1	A									A
AlGaAs			R1			R1		GaAs-AlGaAs Etch (Unaxis VLR)								A
AlGaN								R1								A
AlN								R1								A
CdZnTe	R1															A
GaAs			R1			R1	R1	GaAs-AlGaAs Etch (Unaxis VLR)								A
GaN			R1			R1		R1								A
GaSb							A	GaSb Etch Unaxis VLR)								A
HfO₂																A
InGaAlAs	InP-InGaAsP-InGaAlAs Etching (RIE 2)							InP-InGaAs-InAlAs Etch (Unaxis VLR)								A
InGaAsP	InP-InGaAsP-InGaAlAs Etching (RIE 2)							InP-InGaAs-InAlAs Etch (Unaxis VLR)								A
InP	InP-InGaAsP-InGaAlAs Etching (RIE 2)					A	A	InP-InGaAs-InAlAs Etch (Unaxis VLR)								R1
ITO	R1															A
Photoresist & ARC		A	R			R	R		A	A	A					A
SiC						R1	A									A
SiN		SiN_x Etching (RIE 3)				R1	R1		A							A
SiO₂		SiO₂ Etching (RIE 3)			A	R1	R1								R1	A
SiOxNy						A	A									A
Ta₂O₅							A									A
TiN																A
TiO₂																A
W-TiW						R1	A									A
ZnO₂																A
ZnS	R1															A
ZnSe	R1															A
ZrO₂																A
Material	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	SLR Fluorine ICP (PlasmaTherm)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	Plasma Clean (YES EcoClean)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)

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