Maskless Aligner (Heidelberg MLA150)

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Maskless Aligner (Heidelberg MLA150) Tool Type Lithography Location Bay 6 Supervisor Biljana Stamenic Supervisor Phone (805) 893-4002 Supervisor E-Mail biljana@ece.ucsb.edu Description Maskless I-Line Photolithography Manufacturer Heidelberg Instruments Model MLA150 Materials I-Line Photoresists

About

The MLA150 allows for arbitrary direct patterning of I-Line photoresists, directly from a CAD drawing/file, with alignment to arbitrary features on the sample. The system uses a digital micromirror device ("DMD", an array of MEMS mirrors) for patterning the exposure light-field, to programmatically expose digitized patterns directly onto the sample - no glass photomasks/reticles are required.

The system has a continuous, automatic autofocus, using either a pneumatic or optical detection. This enables lithography on non-planar or curved substrates. We also have the high-aspect ratio (variable/long focal length) option installed for very thick (~70µm) photoresists.

Depending on the exposure options and write area, MLA is able to expose a 100mm wafer in about 30min, and achieves minimum features sizes around 0.5µm, with overlay/alignment accuracy better than 200nm.

Lastly, the greyscale lithography is possible, producing repeatable, slanted or tapered structures in photoresist or photo-active dielectrics like SU-8.

Detailed Specifications

• Wafer size:
• Wafer / substrate thickness:
• Exposure optics:
  • Laser #1: 375nm
  • Laser #2: 405nm
• Focus modes:
• Alignment:
  • Modes?
  • Accuracy:
  • Repetability

• Additional manufacturer options:
  • Focus option?
  • Dual lasers?
  • High-resolution option?

• Uniformity:
• Write speeds:

Documentation

• MLA150 - Standard Operating Procedure

Design Tools/Info

• MLA150 - Design Guidelines
• MLA150 - CAD Files and Templates

Recipes

• Recipes > Lithography > Maskless Aligner MLA150
  • Starting recipes for various I-Line photoresists