Mike Silva: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
(→Tools) |
||
Line 18: | Line 18: | ||
|-valign="top" |
|-valign="top" |
||
| |
| |
||
*[[High Temp Oven (Blue M)]] |
|||
*[[Sputter 5 (Lesker AXXIS)]] |
|||
*[[Ion Beam Deposition (Veeco NEXUS)]] |
|||
*[[ICP Etch 2 (Panasonic E640)]] |
|||
*[[Plasma Clean (Gasonics 2000)]] |
|||
|| |
|| |
||
*[[HF Vapor Etch]] |
*[[HF Vapor Etch]] |
||
* [[Tube Furnace Wafer Bonding (Thermco)]] |
|||
* [[Step Profilometer (Dektak 6M)]] |
* [[Step Profilometer (Dektak 6M)]] |
||
* [[Film Stress (Tencor Flexus)]] |
|||
* [[Optical Film Thickness (Nanometric)]] |
* [[Optical Film Thickness (Nanometric)]] |
||
|} |
|} |
Revision as of 18:26, 27 October 2021
|
About
Information to come.
Current Work
Information to come.
Tools
Mike Silva is in charge of the following tools: