Difference between revisions of "Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick"
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(link to Logitech Wafer Bonder) |
(added POLOS cleaning step) |
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*Turn off Logitech bonder (bottom right of machine chassis) |
*Turn off Logitech bonder (bottom right of machine chassis) |
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**Close lid and clamp |
**Close lid and clamp |
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+ | *Clean excess wax off your wafer using the [[Wet Benches#Automated Wet-processing Spinners .28POLOS.29|POLOS Spinners]], and an Acetone squirt bottle, followed by ISO & N2 dry (run both sides of the wafer). |
Revision as of 14:35, 15 November 2021
Contributed by Miguel Daal, Mazin Group -- 2018-04-24
Procedure for wax-mounting a 100mm Silicon wafer to another 100mm silicon carrier wafer, using the Logitech WBS7 Wafer Bonder.
- Cover Hotplate surface with tinfoil, heat hotplate to 120°C. (Keep flammable solvents away!)
- Place 4" polished handle wafer on hotplate.
- Apply wax to center of wafer only, approximately 2-inch diameter size puddle of crystal bond wax directly from the crystalbond stick.
- For mounting a 4-inch wafer, you need a good amount of wax to ensure coverage to wafer edges, eg.2-3mm thick.
- Then remove wafer from hotplate. and cool.
- Open Logitech Bonder chamber:
- Unscrew clamp until higher than clamp arm,
- Swing front of clamp arm to the left (Difficult to disengage),
- Lift bonder lid (also takes some force to open - ignore vacuum reading on digital display)
- On the glass plate of the Logitech bonder:
- Align work wafer on top of handle wafer placed.
- Align the two wafers' flats.
- Place 6" piece of filter paper on top of work wafer.
- Turn on Logitech bonder power (bottom right of machine chassis)
- Close and lock Logitech bonder hatch.
- On front panel of Logitech bonder, confirm that Applied Pressure gauge is set to 5 psi.
- Enter the process settings:
- [setup] -> [Temp]
- Bonding: 120°C
- Endpoint: 65°C
- Offset: 20°C
- Units: C
- [setup] -> [Vac Thres]
- Proceed if Below: 2.4E+01 mBar
- Abort if Below: 3.2E+01 mBar
- [setup] -> [Process Control]
- Process: Heat + Outgas
- Soak: 5min
- Bond: 15min
- O.G. Limit: 20min
- P.P. del: 1min
- [Setup] -> [Heads]
- Head 1 On
- [setup] -> [Temp]
- Start Process: [Process] -> [Start]
- Process takes about 45min
- Unload when it displays Status: Ready
- If wax leaked onto the glass plate: remove glass plate and clean with Acetone+Wipe.
- Turn off Logitech bonder (bottom right of machine chassis)
- Close lid and clamp
- Clean excess wax off your wafer using the POLOS Spinners, and an Acetone squirt bottle, followed by ISO & N2 dry (run both sides of the wafer).