Maskless Aligner (Raith PicoMaster XF)

Maskless Aligner (Raith PicoMaster XF) Location Bay 7 Tool Type Lithography Manufacturer Raith Gmbh Model Picomaster XF 200 Description Direct-Write (Maskless) I-Line Photolithography Primary Supervisor Biljana Stamenic (805) 893-4002 biljana@ece.ucsb.edu Secondary Supervisor Lee Sawyer Materials I-Line Photoresists Recipes SignupMonkey: Sign up for this tool

Instructions + Procedures

Sign Up

Get Trained

Maintenance Messages

Report Issue

Work In Progress This article is still under construction. It may contain factual errors. Content is subject to change.

About

The Raith PicoMaster XF 200 allows for arbitrary direct-write patterning of I-Line photoresists from an uploaded CAD drawing/file (GDS, DXF, CIF etc.). The system uses a Grating Light Valve ("GLV") for patterning the exposure light-field, to programmatically expose digitized patterns directly onto the sample - no glass photomasks/reticles are required.

Depending on the exposure options and write area, the PicoMaster is able to expose a 100mm wafer in about 60min, and achieves minimum features sizes around 0.5µm, with overlay/alignment accuracy better than 200nm.

Detailed Specifications

• Maximum Writeable Area: TBD
• Substrate size: 200mm round down to 1cm pieces
• Wafer / substrate thickness: Max. / Min. TBD
• Exposure optics:
  • Digital micromirror device (DMD)
  • Laser: 405nm
  • Lens NA = TBD
• Alignment Accuracy: Global ≤ 500nm; Local ("Field") ≤ 250nm
• Linewidth variation: ≤100nm (relevant to stitched exposure fields)
• Minimum Features: ~0.40µm line/space demonstrated with 0.5µm-thick PR. Requires additional effort. ≥1µm is relatively straightforward.
• Write Grid (Address Unit): TBD

• Additional manufacturer options:
  • Backside alignment

Operating Procedures

Standard Operating Procedures

• PicoMaster XF 200- Standard Operating Procedure - updated Sept 26th 2026
  • Includes File-upload procedure, CAD Conversion, Exposure and Alignment.
  • User manuals are available at the tool and on the tool's computer.

Training Procedure

To get authorized on this tool:

Request Training

Design Info - CAD layout

• Design Guidelines + Tips - Important info for designing your CAD files, alignment marks etc.
• CAD Files and Templates - example CAD designs and useful CAD structures.

Recipes

• Recipes > Lithography > Direct-Write_Lithography_Recipes#Maskless_Aligner_(Raith_PicoMasterXF)
  • Starting recipes for various I-Line photoresists

Calibrate your own Litho process

• Use Series mode exposure for doing an FEM ("Focus-Exposure Matrix") on the MLA150.
• Lithography Calibration - Analyzing a Focus-Exposure Matrix - how to analyze an FEM for repeatable processes

Litho. recipes for all our photolith. tools can be found on the Photolithography Recipes page.