HF Vapor Etch: Difference between revisions
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= About = |
= About = |
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The applications of this tool are mainly in MEMS-device fabrication areas (releasing a MEMS structure by etching a sacrificial SiO<sub>2</sub> layer below) with the use of Al<sub>2</sub>O<sub>3</sub>, Al or some other metal as an etch mask at |
The applications of this tool are mainly in MEMS-device fabrication areas (releasing a MEMS structure by etching a sacrificial SiO<sub>2</sub> layer below) with the use of Al<sub>2</sub>O<sub>3</sub>, Al or some other metal as an etch mask at 60<sup>o</sup>C. The tool uses vapor HF (VHF), EtOH |
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=Documentation= |
=Documentation= |
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*[[media:Xactic-XetchX3-System-Manual.pdf|System Manual]] |
*[[media:Xactic-XetchX3-System-Manual.pdf|System Manual]] |
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Revision as of 18:39, 30 January 2014
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About
The applications of this tool are mainly in MEMS-device fabrication areas (releasing a MEMS structure by etching a sacrificial SiO2 layer below) with the use of Al2O3, Al or some other metal as an etch mask at 60oC. The tool uses vapor HF (VHF), EtOH