Plasma Activation (EVG 810): Difference between revisions
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Revision as of 13:40, 11 July 2012
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About
This a capacitively coupled Oxygen plasma activation system used exclusively for the surface activation of clean surfaces prior to wafer bonding. This technique allows bonding temperatures to be lowered and is used as a companion tool to the Karl-Suss SB6 wafer bond tool.
Detailed Specifications
- Gases used: O2 and N2
- Sample size: pieces to 6” wafer