Plasma Activation (EVG 810): Difference between revisions
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|picture=EVG.jpg |
|picture=EVG.jpg |
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|type = Dry Etch |
|type = Dry Etch |
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|super= |
|super= Lee Sawyer |
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|phone= 805-893- |
|phone= 805-893-2123 |
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|location=Bay 7 |
|location=Bay 7 |
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|email= |
|email=lee_sawyer@ucsb.edu |
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|description = Plasma Surface Activation |
|description = Plasma Surface Activation |
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|manufacturer = EVG Group |
|manufacturer = EVG Group |
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Revision as of 17:21, 20 August 2019
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About
This a capacitively coupled Oxygen plasma activation system used exclusively for the surface activation of clean surfaces prior to wafer bonding. This technique allows bonding temperatures to be lowered and is used as a companion tool to the Karl-Suss SB6 wafer bond tool.
Detailed Specifications
- Gases used: O2 and N2
- Sample size: pieces to 6” wafer