Test Data of etching SiO2 with CHF3/CF4/O2 (using this recipe only for Fluorine etch of the underneath layer): Difference between revisions

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[https://www.nanotech.ucsb.edu/wiki/index.php/File:SiO2_Etch_using_ICP2_with_O2-a.pdf https://www.nanotech.ucsb.edu/wiki/images/f/f1/SiO2_Etch_using_ICP2_with_O2-a.pdf]

Revision as of 18:45, 29 January 2019

ICP#2: 0.5Pa, 50/500W, CHF3/CF4/O2=35/5/10sccm, time=210 sec
Date Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Averaged Sidewall Angle (o)
10/5/2018 SiO2#01 95.2 0.74 77.9
1/28/19 I21902 92.1 0.77
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