Wafer Bonder (Logitech WBS7): Difference between revisions

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Revision as of 23:02, 22 August 2018

Wafer Bonder (Logitech WBS7)
[[image:|300x350px|center|]]
Tool Type Thermal Processing
Location Bay 5
Supervisor Don Freeborn
Supervisor Phone (805) 893-7975
Supervisor E-Mail dfreeborn@ece.ucsb.edu
Description Wafer Bonder WSB7
Manufacturer Logitech


About

Detailed Specifications

Operation Procedures

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