NanoFab Process Group: Difference between revisions
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(created page, Links to various dicing procedures. Added Process Control links as well.) |
(→Dicing Procedures: changed link from "new/fresh tape" to just "on tape" - will include the variation on the target page.) |
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* [[ProcessGroup: PR Spin for Dicing Protect - UV6|PR Spin for Dicing Protect]] - ~800nm thick PR only (UV6) |
* [[ProcessGroup: PR Spin for Dicing Protect - UV6|PR Spin for Dicing Protect]] - ~800nm thick PR only (UV6) |
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* [[ProcessGroup: PR Clean of UV-6|PR Clean of UV-6]] |
* [[ProcessGroup: PR Clean of UV-6|PR Clean of UV-6]] |
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* [[ProcessGroup: Shipping on |
* [[ProcessGroup: Shipping Samples on Dicing Tape+Frame|Shipping Samples on Dicing Tape+Frame]] |
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=== Dicing Alignment Mark Exposure === |
=== Dicing Alignment Mark Exposure === |
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Revision as of 23:46, 4 September 2018
This page lists various processes used internally by the NanoFab Process Group.
Dicing Procedures
Photoresist Application, Cleaning and Shipping
- PR Spin for Dicing Protect - ~800nm thick PR only (UV6)
- PR Clean of UV-6
- Shipping Samples on Dicing Tape+Frame
Dicing Alignment Mark Exposure
For providing alignment marks to use while dicing.
- ASML Stepper #3: Dicing Alignment Guides
- How to program the ASML to shoot some alignment markers for use during dicing.
Process Control Calibration Procedures
Etching Tools
- Unaxis PM1: Indium Phosphide Etch Verification Procedure
- ICP#1/2: SiO2 Etch Verification Procedure
- PlasmaTherm SLR: SiO2 Etch Verification Procedure
- PlasmaTherm DSEiii: Si Etch Verification Procedure