Automated Coat/Develop System (S-Cubed Flexi): Difference between revisions

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=Detailed Specifications=
=Detailed Specifications=


* Wafer Size:
*Wafer Size: 100mm (150mm possible but not set up)
*PR Coating Properties:
⚫
* Photoresists/Underlayers Available:
**Uniformity < 1.0%
⚫
* Solvents Available:
**< 100 particles on 100mm wafer
⚫
* Developers Available:
⚫
*Photoresists/Underlayers Available:
**UV6-0.8
**DS-K101-304
**PMMA
**PMGI SF11
**PMGI SF5
⚫
*Solvents Available:
**EBR100
⚫
*Developers Available:
**AZ 300 MiF


=Process Information=
=Process Information=


*Recipe Page for S-Cubed Coater: [[Lithography Recipes#Automated%20Coat.2FDevelop%20System%20Recipes%20.28S-Cubed%20Flexi.29|Lithography Recipes > Automated Coat/Develop System Recipes (S-Cubed Flexi]])
* TBD


=Operating Procedures=
=Operating Procedures=


*''To Be Added''
* TBD

Revision as of 23:00, 8 October 2019

Automated Coat/Develop System (S-Cubed Flexi)
TBD.jpg
Tool Type Lithography
Location Bay 7
Supervisor Tony Bosch
Supervisor Phone (805) 893-3486
Supervisor E-Mail bosch@ece.ucsb.edu
Description Automatic Coat/Bake/Develop
Manufacturer S-Cubed
Lithography Recipes


About

To Be Added

Detailed Specifications

  • Wafer Size: 100mm (150mm possible but not set up)
  • PR Coating Properties:
    • Uniformity < 1.0%
    • < 100 particles on 100mm wafer
  • Photoresists/Underlayers Available:
    • UV6-0.8
    • DS-K101-304
    • PMMA
    • PMGI SF11
    • PMGI SF5
  • Solvents Available:
    • EBR100
  • Developers Available:
    • AZ 300 MiF

Process Information

Operating Procedures

  • To Be Added
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