Thermal Evap 2 (Solder): Difference between revisions
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= About = |
== About == |
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Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. |
Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. |
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Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators. |
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Wafers up to 12" can be mounted. |
Wafers up to 12" can be mounted. |
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=Documentation= |
==Documentation== |
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*[ |
*[//wiki.nanotech.ucsb.edu/w/images/b/b3/Thermal_Evaporator2.pdf Operating Instructions] |
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== Recipes == |
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= Materials Table = |
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* [[Thermal Evaporation Recipes#Thermal Evaporator 2|Recipes > Thermal Evaporation Recipes > Thermal Evaporator 2]] |
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** ''Visit this page for the materials tables and evaporation parameters.'' |
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==Data== |
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[[Thermal Evaporation Recipes]] |
Revision as of 16:26, 19 May 2020
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About
Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin.
Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators.
Detailed Specifications
Wafers up to 12" can be mounted.
Documentation
Recipes
- Recipes > Thermal Evaporation Recipes > Thermal Evaporator 2
- Visit this page for the materials tables and evaporation parameters.