Maskless Aligner (Heidelberg MLA150): Difference between revisions
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== Recipes == |
== Recipes == |
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* '''Recipes > Lithography >''' |
* '''Recipes > Lithography >''' '''<u>[[Maskless Aligner Recipes#Maskless Aligner .28Heidelberg MLA150.29|Maskless Aligner MLA150]]</u>''' |
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** ''Starting recipes for various I-Line photoresists'' |
** ''Starting recipes for various I-Line photoresists'' |
Revision as of 06:33, 14 September 2020
Work In Progress This article is still under construction. It may contain factual errors. Content is subject to change. |
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About
The MLA150 allows for arbitrary direct patterning of I-Line photoresists, directly from a CAD drawing/file, and alignment to arbitrary features on the sample. The system uses a optical digital light process (MEMS light-field patterning) to programatically expose digitized patterns directly onto the sample - no glass photomasks/reticles are required.
Detailed Specifications
- Wafer size:
- Wafer / substrate thickness:
- Exposure optics:
- Laser #1:
- Laser #2:
- Focus modes:
- Alignment:
- Modes?
- Accuracy:
- Repetability
- Additional manufacturer options (none installed on our systems):
- Focus option?
- Dual lasers?
- High-resolution option?
- Uniformity:
- Write speeds:
Documentation
Design Tools/Info
Recipes
- Recipes > Lithography > Maskless Aligner MLA150
- Starting recipes for various I-Line photoresists