Dicing Saw (ADT): Difference between revisions
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== Operating Procedures == |
== Operating Procedures == |
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* [https://wiki.nanotech.ucsb.edu/w/images/ |
* [https://wiki.nanotech.ucsb.edu/w/images/1/12/ADT_Dicing_Saw_SOP_Rev_C.pdf ADT Dicing Saw Standard Operating Procedure] |
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* [[ADT 7100 - Initial Setup Before Cutting|Setting up the Saw before Cutting]] - Disregard and refer to SOP above |
* [[ADT 7100 - Initial Setup Before Cutting|Setting up the Saw before Cutting]] - Disregard and refer to SOP above |
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* [[ADT 7100 - Standard Dicing Procedure - Programmed Cut Map|Standard Dicing Procedure - Programmed Cut Map]] |
* [[ADT 7100 - Standard Dicing Procedure - Programmed Cut Map|Standard Dicing Procedure - Programmed Cut Map]] |
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Revision as of 16:01, 20 August 2021
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About
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.
Contact the tool supervisor for blades and dicing frames for your group.
Detailed Specifications
Operating Procedures
- ADT Dicing Saw Standard Operating Procedure
- Setting up the Saw before Cutting - Disregard and refer to SOP above
- Standard Dicing Procedure - Programmed Cut Map
- Standard Dicing Procedure - Single Cuts
- Recovering an Old Recipe
Recipes
- Recipes > Packaging > Dicing Saw Recipes (ADT 7100)
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.