Chemical-Mechanical Polisher (Logitech): Difference between revisions

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|picture=CMP.jpg
|picture=CMP.jpg
|type = Dry Etch
|type = Dry Etch
|super= Brian Lingg
|super= Bill Millerski
|phone=(805)839-3918x216
|phone=(805)839-3918x216
|location=Bay 5
|location=Bay 5

Revision as of 15:31, 28 October 2021

Chemical-Mechanical Polisher (Logitech)
CMP.jpg
Tool Type Dry Etch
Location Bay 5
Supervisor Bill Millerski
Supervisor Phone (805) 893-2655
Supervisor E-Mail wmillerski@ucsb.edu
Description ORBIS Chemical Mechanical Polisher
Manufacturer Logitech
Dry Etch Recipes
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About

The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system. Several slurries and pads are available to provide a range of polishing options depending on the material being processed. Pieces can also be handled on the system. Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications. Logitech directly assists our users through expert consultation.