Process Group Interns: Difference between revisions
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! align="center" bgcolor="#D0E7FF" width="150" |'''Tasks''' |
! align="center" bgcolor="#D0E7FF" width="150" |'''Tasks''' |
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!Semesters |
!Semesters |
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|Shiven Bhatt |
|Shiven Bhatt |
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|Physics |
|Physics |
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|Dry Etch, PECVD Dep, Dry Etch, Lithography, Metal Dep, ICP-PECVD, Ion-Beam Dep |
|Dry Etch, PECVD Dep, Dry Etch, Lithography, Metal Dep, ICP-PECVD, Ion-Beam Dep |
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|Fall 2024- |
|Fall 2024-Spring 2025 |
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|Javier Zamora Juarez |
|Javier Zamora Juarez |
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|PECVD Dep., Dry Etch, Data Analysis |
|PECVD Dep., Dry Etch, Data Analysis |
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|Fall 2022–Summer 2023 |
|Fall 2022–Summer 2023 |
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|Henry Allen |
|Henry Allen |
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|PECVD Deposition |
|PECVD Deposition |
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|Summer 2022–Fall 2022 |
|Summer 2022–Fall 2022 |
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|Nirav Pakala |
|Nirav Pakala |
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Revision as of 00:11, 23 July 2025
The process group hosts a number of interns each year! Find out more on our internship page.
Current Interns
| Name | Major | Tasks | Semesters |
|---|---|---|---|
| Shiven Bhatt | Electrical Engineering | Dry Etch, PECVD Dep | Spring 2025–present |
| Tanvi Kamath | Chemical Engineering | Glass Dep & Litho | Spring 2025–present |
| Ornob Barua | Mechanical Engineering | Dry Etch & Litho | Spring 2025–present |
| William Cheng | Electrical & Computer Engineering | Dry Etch, Glass Dep & Litho | Spring 2025–present |
| Diego Caceres Ceballos | Physics | Dry Etch, PECVD Dep, Sputter Dep | Summer 2025-present |
Alumni
| Name | Major | Tasks | Semesters |
|---|---|---|---|
| Terry Guerrero | Physics | Dry Etch, PECVD Dep, Dry Etch, Lithography, Metal Dep, ICP-PECVD, Ion-Beam Dep | Fall 2024-Spring 2025 |
| Javier Zamora Juarez | Electrical Engineering | PECVD Dep, Dry Etch, Lithography, E-Beam Dep (Developed), Lithography Development | Summer 2024-Spring 2025 |
| Jiaheng "Robin" Teng | Mechanical Engineering | PECVD Deposition, Dry Etch, Lithography, Ion Beam Dep, ICP-PEVCD Dep | Spring 2024–present |
| Dhruv Patel | Computer Science | Dry Etch, PECVD Dep, Lithography | Summer 2024–Winter 2025 |
| Haley Hughes | Electrical Engineering | PECVD Dep, ICP-PECVD Dep., Dry Etch, Lithography | Winter 2024–Winter 2025 |
| William Matthews | Dos Pueblos High School | PECVD Dep, Dry Etch, Lithography | Summer 2023–Summer 2024 |
| Phineas Lehan | Chemical Engineering | Dry Etch, PECVD Deposition | Winter 2023–Spring 2024 |
| Allison Lebus | Electrical Engineering | PECVD Deposition, ICP-PECVD Dep, Ion Beam Dep., Traveler/spreadsheet Automation | Winter 2023–Spring 2024 |
| Judas Strayer | Physics | PECVD Dep., Dry Etch, Data Analysis | Fall 2022–Summer 2023 |
| Henry Allen | Mechanical Engineering | PECVD Deposition | Summer 2022–Fall 2022 |
| Noah Dutra | Chemical Engineering | Dry Etch, Lithography Development | Spring 2022–Spring 2023 |
| Nirav Pakala | Electrical Engineering | Dry Etch & Dry Etch Development/DOE | Winter 2022–Summer 2022 |
| Salim Tarazi | Electrical Engineering | PECVD Deposition | Winter 2022–Summer 2022 |
| Nastazia Moshirfatemi | Physics | PECVD Deposition, ICP-PECVD Dep, Ion Beam Dep, Data Analysis & Visualization | Summer 2021–Winter 2022 |