Oven 4 (Thermo-Fisher HeraTherm): Difference between revisions

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==Documentation==
==Documentation==


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* [https://wiki.nanotech.ucsb.edu/w/images/8/8e/Heratherm_instructions.pdf Instructions (from HeraTherm)]
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{{Instructions}}

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[https://wiki.nanotech.ucsb.edu/w/images/8/8e/Heratherm_instructions.pdf Instructions]


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Latest revision as of 20:04, 25 February 2026

Oven 4 (Thermo-Fisher HeraTherm)
Location Bay 6
Tool Type Lithography
Manufacturer Thermo Scientific
Model HeraTherm
Description Programmable Oven
Primary Supervisor Michael Barreraz
(805) 893-4147
mikebarreraz@ece.ucsb.edu

Secondary Supervisor

Aidan Hopkins

Recipes
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About

This oven is often used for long thermal cures and wafer bonding. It has programmable temperature ramps and hold times, but the ramp rate is only "low/med./high" (not an exact ramp rate). A manual needle valve for nitrogen purge has been installed on the back of the oven.

Specifications

  • Maximum Temperature = 330 C (no active cooling)
  • Gases: N2, manually set with needle valve (not programmable)
  • Multi-step programmable temperature ramps
  • Programmable atmospheric purge (for cooling)

Documentation


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