Automated Coat/Develop System (S-Cubed Flexi): Difference between revisions

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**[https://wiki.nanofab.ucsb.edu/w/images/3/38/UV6-Positive-Resist-Datasheet.pdf UV6-0.8] - DUV Positive imaging resist
**[https://wiki.nanofab.ucsb.edu/w/images/3/38/UV6-Positive-Resist-Datasheet.pdf UV6-0.8] - DUV Positive imaging resist
**[[Stepper Recipes#DS-K101-304|DS-K101-304]] - DUV bottom anti-reflection layer (BARC).
**[[Stepper Recipes#DS-K101-304|DS-K101-304]] - DUV bottom anti-reflection layer (BARC).
**PMMA - '''<u>NOT FOR PUBLIC USE AT THIS TIME</u>'''
**PMMA - '''NOT FOR PUBLIC USE AT THIS TIME'''
**PMGI SF11 - '''<u>NOT FOR PUBLIC USE AT THIS TIME</u>'''
**PMGI SF11 - '''NOT FOR PUBLIC USE AT THIS TIME'''
**PMGI SF5 - '''<u>NOT FOR PUBLIC USE AT THIS TIME</u>'''
**PMGI SF5 - '''NOT FOR PUBLIC USE AT THIS TIME'''
*Solvents Available:
*Solvents Available:
**EBR100 (wafer backside cleaning)
**EBR100 (wafer backside cleaning)
*Developers Available:
*Developers Available:
**[https://wiki.nanofab.ucsb.edu/w/images/f/f0/AZ300MIF-Developer-Datasheet.pdf AZ 300 MiF] - ''now available to use! (2024-07)''
**[https://wiki.nanofab.ucsb.edu/w/images/f/f0/AZ300MIF-Developer-Datasheet.pdf AZ 300 MiF]
*Hotplates Available:
*Hotplates Available:
**135°C - for UV6 soft-bake and Post-Exposure Bake
**135°C - for UV6 soft-bake and Post-Exposure Bake

Latest revision as of 17:16, 25 June 2026

Automated Coat/Develop System (S-Cubed Flexi)
Location Bay 7
Tool Type Wet Processing
Manufacturer S-Cubed
Model Flexi (Custom)
Description Automatic Coat/Bake/Develop
Primary Supervisor Tony Bosch
(805) 893-3486
bosch@ece.ucsb.edu

Secondary Supervisor

Lee Sawyer

Recipes Wet Processing Recipes
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About

The S3-Coater is a Coater/Developer system that has one photoresist spinner, one developer spinner and 4 hotplates each with independent temperature control and a chill plate. A central robot picks your wafer/s from one of 2 cassettes, processes them and returns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination, and coats photoresists with low particle counts/streaks and high uniformity.

Only full size 4-inch (100mm) substrates are allowed on this system.

Detailed Specifications

  • Wafer Size: 100mm
  • PR Coating Properties:
    • Uniformity < 1.0%
    • < 100 particles on 100mm wafer
  • Photoresists/Underlayers Available:
    • UV6-0.8 - DUV Positive imaging resist
    • DS-K101-304 - DUV bottom anti-reflection layer (BARC).
    • PMMA - NOT FOR PUBLIC USE AT THIS TIME
    • PMGI SF11 - NOT FOR PUBLIC USE AT THIS TIME
    • PMGI SF5 - NOT FOR PUBLIC USE AT THIS TIME
  • Solvents Available:
    • EBR100 (wafer backside cleaning)
  • Developers Available:
  • Hotplates Available:
    • 135°C - for UV6 soft-bake and Post-Exposure Bake
    • 220°C - for DSK101 BARC soft-bake - dry etchable
    • 185*C - for DSK101 BARC soft-bake - developable for undercut

Process Information

Operating Procedures

Recipes

  • Recipes > Lithography > Automated Coater Recipes - See all available spin-coat recipes for this machine. Only Staff may edit/create recipes.
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