Lift-off DUV Lift-off: LOR Underlayers: Difference between revisions

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added LOR 10A recipe from alex spott
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=== LOR30C ===
=== LOR10A - ~1µm underlayer ===
{| class="wikitable"
|Dehydration bake
|≥150°C
|5 min
|-
|Spin LOR10A
|Recipe 5: 3000 rpm
|
|-
|Backside clean
|Spin/spray: Remover PG / Acetone / IPA
|required for ASML DUV
|-
|Softbake
|200°C on lift-pins.
Use recipe: "''STD 200C 5min''"
|5 min
|-
|Spin LOR10A
|Recipe 5: 3000 rpm
|
|-
|Backside clean
|Spin/spray: Remover PG / Acetone / IPA
|
|-
|Softbake
|200 C on pins. Use recipe 200 C 5 min.
|5 min
|-
|Spin UV6-0.8
|Recipe 6 3500 rpm
|
|-
|Softbake
|135C
|1 min
|-
|Backside clean
|Spin/spray Acetone/IPA
|
|-
|Expose
|~21-25mJ - you may need to optimize
Focus = +0.2
|ASML
|-
|Post exposure bake
|135C
|90 sec
|-
|Develop AZ726MIF
|no agitation
|usually > 2.5min
|-
|Microscope Inspect
|Check undercut
|Typ. ~1-2µm
|}

=== LOR30C - ~30µm underlayer ===


# Dehydrate (O2 plasma or 150°C, 2 min+), no adhesion promoter
# Dehydrate (O2 plasma or 150°C, 2 min+), no adhesion promoter

Revision as of 22:39, 23 September 2026

LOR10A - ~1µm underlayer

Dehydration bake ≥150°C 5 min
Spin LOR10A Recipe 5: 3000 rpm
Backside clean Spin/spray: Remover PG / Acetone / IPA required for ASML DUV
Softbake 200°C on lift-pins.

Use recipe: "STD 200C 5min"

5 min
Spin LOR10A Recipe 5: 3000 rpm
Backside clean Spin/spray: Remover PG / Acetone / IPA
Softbake 200 C on pins. Use recipe 200 C 5 min. 5 min
Spin UV6-0.8 Recipe 6 3500 rpm
Softbake 135C 1 min
Backside clean Spin/spray Acetone/IPA
Expose ~21-25mJ - you may need to optimize

Focus = +0.2

ASML
Post exposure bake 135C 90 sec
Develop AZ726MIF no agitation usually > 2.5min
Microscope Inspect Check undercut Typ. ~1-2µm

LOR30C - ~30µm underlayer

  1. Dehydrate (O2 plasma or 150°C, 2 min+), no adhesion promoter
  2. Spin LOR30C at various speeds depending on thickness desired
    1. See datasheet for spin-curves.
  3. 180°C, 4 min
  4. Spin/bake imaging layer - according to Imaging PR recipe
  5. Expose ASML
  6. Post-bake imaging layer - according to Imaging PR recipe
  7. Develop AZ 300MiF - varies:
    1. Develop times range between 2 min to as long as 6 or 8 minutes (it's consistent for the same mask and same materials, but varies for process steps, topography, and materials).
  8. Strips in 80C NMP 20–30 min

Pros: Thick in a single layer, excellent coverage for tall features, varying topography, and filling vias. Rarely has cracking issues, no ramp baking required, typically minimal bubbles from feature corners.

Cons: High and uncontrollable undercut. You can't switch to flood expose / 101A like you can with PMGI so you're stuck with the undercut you get whenever it's done developing. Not suitable for close features.

Contributed by Alex Spott.

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