Maskless Aligner (Raith PicoMaster XF): Difference between revisions
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==Detailed Specifications== |
==Detailed Specifications== |
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*Maximum Writeable Area: TBD |
*Maximum Writeable Area: TBD |
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*Substrate size: 200mm round down to 1cm pieces |
*Substrate size: 200mm round down to 1cm pieces |
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==Operating Procedures== |
==Operating Procedures== |
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===Standard Operating Procedures=== |
===Standard Operating Procedures=== |
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==Design Info - CAD layout== |
==Design Info - CAD layout== |
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*[[MLA150 - Design Guidelines|Design Guidelines + Tips]] - ''Important info for designing your CAD files, alignment marks etc.'' |
*[[MLA150 - Design Guidelines|Design Guidelines + Tips]] - ''Important info for designing your CAD files, alignment marks etc.'' |
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*[[MLA150 - CAD Files and Templates|CAD Files and Templates]] - ''example CAD designs and useful CAD structures.'' |
*[[MLA150 - CAD Files and Templates|CAD Files and Templates]] - ''example CAD designs and useful CAD structures.'' |
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==Recipes== |
==Recipes== |
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*'''Recipes > Lithography >''' '''<u>[[Direct-Write_Lithography_Recipes#Maskless_Aligner_(Raith_PicoMasterXF)]]</u>''' |
*'''Recipes > Lithography >''' '''<u>[[Direct-Write_Lithography_Recipes#Maskless_Aligner_(Raith_PicoMasterXF)]]</u>''' |
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**''Starting recipes for various I-Line photoresists'' |
**''Starting recipes for various I-Line photoresists'' |
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Revision as of 05:45, 5 November 2026
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Work In Progress This article is still under construction. It may contain factual errors. Content is subject to change. |
About
The Raith PicoMaster XF 200 allows for arbitrary direct-write patterning of I-Line photoresists from an uploaded CAD drawing/file (GDS, DXF, CIF etc.). The system uses a Grating Light Valve ("GLV") for patterning the exposure light-field, to programmatically expose digitized patterns directly onto the sample - no glass photomasks/reticles are required.
Depending on the exposure options and write area, the PicoMaster is able to expose a 100mm wafer in about 60min, and achieves minimum features sizes around 0.5µm, with overlay/alignment accuracy better than 200nm.
Detailed Specifications
- Maximum Writeable Area: TBD
- Substrate size: 200mm round down to 1cm pieces
- Wafer / substrate thickness: Max. / Min. TBD
- Exposure optics:
- Digital micromirror device (DMD)
- Laser: 405nm
- Lens NA = TBD
- Alignment Accuracy: Global ≤ 500nm; Local ("Field") ≤ 250nm
- Linewidth variation: ≤100nm (relevant to stitched exposure fields)
- Minimum Features: ~0.40µm line/space demonstrated with 0.5µm-thick PR. Requires additional effort. ≥1µm is relatively straightforward.
- Write Grid (Address Unit): TBD
- Additional manufacturer options:
- Backside alignment
Operating Procedures
Standard Operating Procedures
- PicoMaster XF 200- Standard Operating Procedure - updated Sept 26th 2026
- Includes File-upload procedure, CAD Conversion, Exposure and Alignment.
- User manuals are available at the tool and on the tool's computer.
Training Procedure
To get authorized on this tool:
| Request Training |
|---|
Design Info - CAD layout
- Design Guidelines + Tips - Important info for designing your CAD files, alignment marks etc.
- CAD Files and Templates - example CAD designs and useful CAD structures.
Recipes
- Recipes > Lithography > Direct-Write_Lithography_Recipes#Maskless_Aligner_(Raith_PicoMasterXF)
- Starting recipes for various I-Line photoresists
Calibrate your own Litho process
- Use Series mode exposure for doing an FEM ("Focus-Exposure Matrix") on the MLA150.
- Lithography Calibration - Analyzing a Focus-Exposure Matrix - how to analyze an FEM for repeatable processes
Litho. recipes for all our photolith. tools can be found on the Photolithography Recipes page.
