Wafer Bonder (Logitech WBS7)
From UCSB Nanofab Wiki
Revision as of 04:41, 19 September 2018 by
John d
(
talk
|
contribs
)
(added crummy scheamtic picture from manual)
(
diff
)
← Older revision
|
Latest revision
(
diff
) |
Newer revision →
(
diff
)
Jump to navigation
Jump to search
Wafer Bonder (Logitech WBS7)
File:Logitech WBS7 Bonder Schematic from Manual.png
Tool Type
Thermal Processing
Location
Bay 5
Supervisor
Don Freeborn
Supervisor Phone
(805) 893-7975
Supervisor E-Mail
dfreeborn@ece.ucsb.edu
Description
Wafer Bonder WSB7
Manufacturer
Logitech
About
Detailed Specifications
Operation Procedures
Categories
:
Pages with broken file links
NOID
Tools
Thermal Processing
Navigation menu
Personal tools
Create account
Log in
Namespaces
Page
Discussion
English
Views
Read
View source
View history
More
Search
InvisibleMenu
QuickLinks
Lab Rules
Common Questions/FAQ
Staff List
Equipment Signup
Chemicals + MSDS
Equipment
Full Tool List
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
Packaging
Metrology & Test
Recipes and Data
Lithography
Vacuum Deposition
Dry Etching
Wet Etching
Thermal Processing
Packaging Tools
Data + Info
Process Control Data
Calculators/Utilities
NanoFab Info
Research + Pubs
Tech Talks
Tools
What links here
Related changes
Special pages
Printable version
Permanent link
Page information