Wafer Bonder (Logitech WBS7)

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Wafer Bonder (Logitech WBS7)
Tool Type Thermal Processing
Location Bay 5
Supervisor Don Freeborn
Supervisor Phone (805) 893-7975
Supervisor E-Mail dfreeborn@ece.ucsb.edu
Description Wafer Bonder WSB7
Manufacturer Logitech


About

This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax. This can be used for through-etching of the sample wafer, for dicing, or sometimes for lithography.

Detailed Specifications

Operation Procedures

Recipes