Plasma Activation (EVG 810)

Plasma Activation (EVG 810) Tool Type Dry Etch Location Bay 7 Supervisor Aidan Hopkins Supervisor Phone (805) 893-2343 Supervisor E-Mail hopkins@ece.ucsb.edu Description Plasma Surface Activation Manufacturer EVG Group Dry Etch Recipes

About

This a capacitively coupled Oxygen plasma activation system used exclusively for the surface activation of clean surfaces prior to wafer bonding. This technique allows bonding temperatures to be lowered and is used as a companion tool to the Karl-Suss SB6 wafer bond tool.

Detailed Specifications

• Gases used: O₂ and N₂
• Sample size: pieces to 6” wafer