ASML Stepper 3 Dicing Guide Programming

How to program the ASML DUV Stepper #3 to place dicing guides in between die.

• Determine a lithography step in the fabrication process during which the addition of dicing guides (crosses) on positive PR would be acceptable and visible during dicing.
• When programming the job, add an new Image in Wafer Layout > Image Definition for the DicingGuides image, as so:
  • Reticle ID: "UCSB-OPC1" (hyphenated)
  • Image Size (Wafer): X = 0.90000; Y = 0.90000 mm
  • Image Shift (Wafer): X = -6.750000; Y= -9.450000 mm
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    ASML Programming: Image Definition Screen
    

    Image Definition: Location on Reticle

• Under Wafer Layout > Image Distribution, add an Image-to-Cell Shift of half the die X/Y size, and Apply to all die, to place the marks at the corner of every die.
  • The software will only let you place the die at the upper-right (+X,+Y) corner. To include the lower-left corners, you will need to make sure you enabled the Wafer Layout > Cell Structure > Die Definition > # of Dies & Minimum per Cell options so it'll shoot partial die.
  • Make sure they don't expose over any of your other alignment marks!

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  Image Distribution: Example dicing mark locations, using Image-to-Cell Shift to place die at corners.